Hollow Heat Dissipation Substrate for Power Module Thermal Stress

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Solution Overview

Problem

Conventional heat dissipation substrates for power semiconductor modules face issues such as increased thermal resistance and separation/bending due to adhesive layers and differing thermal expansion coefficients, leading to reduced heat dissipation performance and potential thermal runaway.

Innovation Solution

A heat dissipation substrate with a hollow structure integrated into the metal plates, formed through a hot press process in a high-temperature, high-pressure vacuum environment, eliminating the need for adhesive layers and ensuring uniform thermal expansion coefficients across components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive layers are used to bond metal plates and ceramic substrates, then bonding strength is improved, but thermal resistance increases and heat dissipation performance deteriorates

Engineering Contradiction:

Improvebonding strengthVSAvoidheat dissipation performance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The invention removes the adhesive layer from the bonding process between metal plates and ceramic substrates. By eliminating this intermediate layer, the patent achieves direct bonding which reduces thermal resistance and improves heat dissipation performance while maintaining bonding strength through direct metallurgical or mechanical bonding of the metal plates to the ceramic substrates.

Inventive Principle:

Principle #2Taking out (Extraction)

2Device complexity

If different materials with different thermal expansion coefficients are bonded together, then structural complexity is reduced, but component separation and bending occur under thermal stress

Engineering Contradiction:

Improvestructural complexityVSAvoidcomponent separation

Core Design Contradiction:

Device complexityVSStability of the object's composition

Solution Approach 1:

The invention introduces a hollow structure within the metal plate that allows for localized thermal expansion compensation. The hollow space enables the metal plate to deform locally under thermal stress without causing separation or bending at the bonding interfaces, thus maintaining overall structural stability while using materials with different thermal expansion coefficients.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If conventional bonding methods are used, then manufacturing process is simplified, but thermal runaway risk increases due to heat trap phenomenon

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidthermal runaway risk

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The invention incorporates a hollow structure within the metal plate that acts as a thermal management feature. This hollow space prevents heat accumulation by providing a pathway for heat dissipation, eliminating the heat trap phenomenon that occurs in conventional solid metal plates while maintaining manufacturing simplicity through integrated formation of the hollow structure during metal plate fabrication.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly improves heat transfer efficiency and reliability by shortening heat transfer paths and preventing component separation, enhancing the overall performance and safety of power semiconductor modules.

Implementation Method 1

A heat dissipation substrate with a hollow structure integrated into the metal plates, formed through a hot press process in a high-temperature, high-pressure vacuum environment

Methodology Applied

Scientific EffectHot press process:

Implementation Method 2

This design significantly improves heat transfer efficiency and reliability by shortening heat transfer paths

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentEP4601001A1A heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same and a power converter including the same, and manufacturing method of the heat dissipation substrate for a power semiconductor module

Publication Date: 2025.08.13 LX SEMICON CO LTD

Figure 1A~2
Figure 3~5A
Figure 5B~6

AI summary

The embodiment relates to a heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same, a power converter including the same, and a method of manufacturing the same. A heat dissipation substrate for a power semiconductor module includes an insulating substrate (410), an intermediate metal plate (420) bonded on a bottom surface of the insulating substrate (410); a second metal plate (422) bonded on a bottom surface of the intermediate metal plate (420); and a first metal plate (421) bonded on a bottom surface of the second metal plate (422). The second metal plate (422) includes a hollow structure (HE).