Power Module Copper-Metal Layer Layout for Hot Spot Dissipation
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Solution Overview
Problem
In power modules with ceramic substrates, high-power chips generate local hot spots due to inadequate heat dissipation, particularly when the copper layer is too thin, leading to difficulties in thermal management and substrate warpage.
Innovation Solution
An additional metal layer with high thermal and electrical conductivity is placed under or around the chip to thicken the copper layer, promoting even heat transfer and expanding the heat dissipation area, which is connected to the substrate to enhance thermal management and reduce substrate warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If the copper layer is made thinner to reduce material usage and cost, then material cost decreases, but heat dissipation capability deteriorates causing local hot spots
Solution Approach 1:
The copper layer is segmented into two distinct layers: a first copper layer directly on the substrate and a second copper layer on the first copper layer. This segmentation allows each layer to have optimized thickness for different functions - the first layer provides structural foundation while the second layer enhances heat dissipation where needed.
Solution Approach 2:
The second copper layer is positioned specifically over the chip area where heat generation is most intense. This local quality enhancement provides improved heat dissipation capability precisely where it is most needed, rather than uniformly thickening the entire copper layer.
2Temperature
If the copper layer is made thicker to improve heat dissipation, then heat dissipation capability improves, but substrate warpage increases
Solution Approach 1:
The copper structure is divided into two layers with the second layer positioned specifically over the chip. This segmentation allows heat dissipation enhancement localized to the hot spot area without uniformly increasing copper thickness across the entire substrate, thereby minimizing thermal expansion-induced warpage.
Solution Approach 2:
The second copper layer is applied locally over the chip area rather than uniformly across the substrate. This localized approach enhances heat dissipation capability where it is most needed while minimizing the overall copper thickness and reducing the risk of substrate warpage.
3Temperature
If a thick copper layer is used to dissipate heat, then heat dissipation improves, but manufacturing complexity increases due to etching and warpage control
Solution Approach 1:
The copper structure is segmented into two layers that can be manufactured separately and then combined. This segmentation allows each layer to be optimized independently for thickness and pattern, simplifying the manufacturing process compared to creating a single thick copper layer with precise etching requirements.
Solution Approach 2:
The solution transitions from considering copper layer thickness as a single-dimensional parameter to a two-layer structure where each layer has its own thickness and positional characteristics. This dimensional approach provides additional degrees of freedom for optimizing both heat dissipation and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves uniform heat dissipation, increases the heat dissipation area, reduces substrate warpage, and conserves copper material usage while effectively managing heat from high-power chips.
Implementation Method 1
an additional metal layer with high thermal and electrical conductivity is placed under or around the chip to thicken the copper layer, promoting even heat transfer
Implementation Method 2
The copper layer is disposed on the substrate. The metal layer is disposed on the copper layer... connected to the substrate to enhance thermal management
Data Source
AI summary
A power module structure is provided. The power module structure includes a substrate, a copper layer, a metal layer, and a chip. The copper layer is disposed on the substrate. The metal layer is disposed on the copper layer. The area of the metal layer is smaller than that of the copper layer. The chip is disposed on the metal layer. The area of the chip is smaller than that of the metal layer.