Power Module Resin Housing Projections for Heat Sink Fixation
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Solution Overview
Problem
Existing power modules face challenges in securely fixing heat sinks to circuit boards without damaging terminals due to vibrations and assembly stress, leading to potential terminal breakage and increased costs.
Innovation Solution
A power module design featuring a resin housing with projections that contact the circuit board and through-holes for lead terminals, allowing for secure attachment of a heat sink while reducing stress on the module by controlling the distance and contact area, and optionally using connecting members or fins for enhanced stability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the through-hole size is enlarged to allow terminal passage and stopper removal, then the package can be brought into contact with the circuit board, but soldering becomes difficult and solder bridges may form between terminals
Solution Approach 1:
The invention divides the housing into multiple segments with individual through-holes positioned between terminal groups. This segmentation allows the housing to contact the circuit board through discrete points rather than requiring large continuous openings, thereby maintaining soldering precision while achieving firm fixation.
2Reliability
If the terminal protrusion length is increased to facilitate stopper passage through enlarged holes, then the package can be mounted, but solder bridges may form between terminals
Solution Approach 1:
The housing acts as an intermediary structure that provides through-holes for terminal passage while maintaining proper terminal spacing. The through-holes are positioned to allow stopper removal without requiring excessive terminal protrusion, thus preventing solder bridges while enabling mounting.
3Reliability
If the package is solidly mounted on the circuit board, then firm fixation is achieved, but excessive stress is applied to the package end portion causing damage
Solution Approach 1:
The invention applies local quality by creating specific contact regions through the through-holes rather than uniform contact across the entire package bottom. This localized contact provides firm fixation at critical points while distributing stress away from the package end portion, preventing damage.
4Adaptability or versatility
If multiple power module types are produced to accommodate different stopper configurations, then various mounting requirements are met, but productivity decreases and management costs increase
Solution Approach 1:
The housing design with through-holes positioned between terminal groups provides universal adaptability for different mounting configurations and stopper types. This single versatile design eliminates the need for multiple specialized power module types, thereby maintaining productivity and reducing management costs.
Data Source
AI summary
Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.