Power Module Housing Molding With Cooled Sleeves for Sealing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The existing methods for producing power semiconductor module housings are elaborate and costly, requiring complex processes and materials that increase production costs and complexity.

Innovation Solution

A device comprising a mold with a cavity, sleeves or hollow bushings, a heating element, and a cooling element is used to inject and harden a mold material around a power semiconductor module arrangement, sealing the cavity and forming a compact housing directly around the module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional methods are used to produce power semiconductor module housings, then the housing can be produced with adequate protection, but the production process becomes elaborate and costly

Engineering Contradiction:

Improveprotection of module componentsVSAvoidproduction process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple production steps into a single injection molding process. The housing, terminal elements, and sealing structures are all formed in one integrated molding operation, eliminating the need for separate assembly steps and reducing overall process complexity while maintaining adequate protection of module components

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The injection molded housing serves multiple functions simultaneously: it provides mechanical protection for the power semiconductor module, creates sealed enclosures through integrated sealing structures, and forms terminal element housings all in a single process, thereby reducing the need for multiple specialized components and assembly steps

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If traditional methods are used to produce power semiconductor module housings, then the housing can be produced with adequate protection, but the production cost increases

Engineering Contradiction:

Improveprotection of module componentsVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses a removable core or insert in the mold that is discarded after a single use for each housing production. This simple disposable core eliminates the need for complex release mechanisms or multi-step demolding processes, reducing manufacturing cost while ensuring adequate protection of the power semiconductor module components

Inventive Principle:

Principle #34Discarding and recovering

3Ease of manufacture

If a simple injection process is used, then the production is easier and more cost-effective, but the sealing of the cavity may be insufficient

Engineering Contradiction:

Improveproduction simplicityVSAvoidsealing of the cavity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent incorporates sealing structures directly into the mold cavity design before injection. The mold includes integrated sealing features such as sealing ribs, gasket grooves, or O-ring channels that are pre-formed as part of the mold structure, ensuring proper sealing action occurs automatically during the injection process without requiring additional sealing steps

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent combines the sealing function with the housing structure itself. The sealing structures are integrated into the housing design and formed simultaneously with the main housing body in the same injection molding process, ensuring that sealing and structural functions are achieved together in a single simplified operation

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the easy and cost-effective production of power semiconductor module housings by simplifying the process and reducing material usage, while ensuring effective sealing and protection of the module components.

Implementation Method 1

heating a mold material and pressing the mold material into the first cavity

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

cooling the plurality of sleeves or hollow bushings by means of the cooling element, wherein the mold material hardens in the vicinity of the first ends

Methodology Applied

Scientific EffectCooling: Cooling

Implementation Method 3

the mold material hardens in the vicinity of the first ends of the plurality of sleeves or hollow bushings when it comes into contact with the respective first end

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentUS12261063B2Method and device for producing a housing

Publication Date: 2025.03.25 INFINEON TECHNOLOGIES AG

AI summary

A device for forming a housing for a power semiconductor module arrangement includes a mold. The mold includes a first cavity including a plurality of first openings and a second opening, the second opening being coupled to a runner system, wherein the runner system is configured to inject a mold material into the first cavity through the second opening. The device further includes a plurality of sleeves or hollow bushings, wherein a first end of each of the plurality of sleeves or hollow bushings is arranged in one of the first openings, and wherein a second end of each of the plurality of sleeves or hollow bushings extends to the outside of the mold, a heating element configured to heat the mold, and a cooling element configured to cool the plurality of sleeves or hollow bushings.