Power Module Housing Sealing Ribs for Corrosion Prevention

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Solution Overview

Problem

Circuit arrangements with power modules and printed circuit boards are prone to failure under extreme climatic conditions due to corrosion of module plate elements, pressure contact elements, and the printed circuit board, leading to unreliable operation and short service life.

Innovation Solution

The base area of the housing features opening sealing ribs around the openings for pressure contact elements, which directly contact the printed circuit board, and a sealing surface element with recesses for pressure contact elements, enhancing moisture prevention and corrosion resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the housing base area has openings for pressure contact elements, then electrical connection between power module and printed circuit board is enabled, but moisture can penetrate through these openings causing corrosion

Engineering Contradiction:
Improvecorrosion resistanceVSAvoidmoisture ingress
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by adding sealing ribs specifically at the openings of the shafts where pressure contact elements pass through. These sealing ribs are localized features on the housing base area that create sealing lips around the openings. This allows the housing to remain open for electrical connection while locally adding sealing functionality at critical moisture entry points, thus preventing corrosion without compromising electrical connectivity.

Inventive Principle:
Principle #3Local quality

2Reliability

If sealing measures are added to prevent moisture ingress, then corrosion resistance improves, but device complexity increases

Engineering Contradiction:
Improvecorrosion resistanceVSAvoidhousing structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the sealing function with the existing housing structure by integrating sealing ribs directly into the housing base area. Instead of adding separate sealing components or assemblies, the sealing ribs are formed as part of the housing itself, combining the structural and sealing functions into a single integrated component. This reduces device complexity while achieving effective moisture protection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the geometric parameters of the housing base area by adding sealing ribs that create sealing lips around the shaft openings. This modifies the surface topology of the housing to include protruding sealing features, which change the physical configuration from a simple flat base area to one with integrated sealing structures, achieving corrosion protection without significant complexity increase.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP1921908B1Circuit assembly with a power module that is combined with a circuit board
Publication Date: 2012.08.01 SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG
  • EP1921908B1 patent drawingFigure 1~3
  • EP1921908B1 patent drawingFigure 4~5
  • EP1921908B1 patent drawingFigure 6~7

AI summary

The arrangement has a power module and a printed circuit board (14) provided between a cooling unit and a pressing device, where the power module and the circuit board are in pressure contact with one another by a pressure contacting unit (28). The power module includes a module plate unit and a can shaped housing (24) that is provided with shafts (26) for the pressure contacting unit. A base area (30) of the housing is designed around orifice openings (40) of the shafts, where opening sealing fins (42) are provided at the orifice openings of the base area.