Multi-Level Power Module Housing with Direct Conductive Wiring
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Solution Overview
Problem
Conventional power modules require a circuit carrier for electrical connections, which increases costs and complexity, and often struggle with thermal management due to mismatched thermal expansion coefficients between materials.
Innovation Solution
A power module design featuring multiple levels with an electrically conductive connection structure applied directly to the surface, eliminating the need for a circuit carrier and using a cement composite or epoxy resin encapsulation compound with filler particles for improved thermal conductivity and reduced thermal stresses, allowing direct soldering or sintering of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit carrier is used for electrical connections in conventional power modules, then reliable electrical connections are achieved, but costs and device complexity increase
Solution Approach 1:
The invention extracts and eliminates the circuit carrier from the power module structure. Instead of using a separate circuit carrier substrate, the connection structure is applied directly to the encapsulation compound, removing the unnecessary intermediate component and reducing overall device complexity while maintaining electrical connection reliability
Solution Approach 2:
The invention merges the functions of the encapsulation compound and the circuit carrier into a single integrated structure. The connection structure is directly applied onto the encapsulation compound surface, combining the protective encapsulation function with the electrical connection function, thereby eliminating the need for a separate circuit carrier
2Ease of manufacture
If conventional materials are used in power modules, then manufacturing is simplified, but thermal management performance deteriorates due to mismatched thermal expansion coefficients
Solution Approach 1:
The invention employs composite materials for both the encapsulation compound and connection structure that are specifically designed to match thermal expansion coefficients. This composite material approach allows simultaneous achievement of manufacturability and superior thermal management by reducing thermal stresses during temperature cycling while maintaining ease of manufacturing processes
3Reliability
If a circuit carrier is used in conventional power modules, then electrical connections are established, but cost increases due to additional components
Solution Approach 1:
The invention extracts and removes the circuit carrier component from the power module assembly, eliminating the associated costs of purchasing, handling, and assembling this separate component while maintaining all necessary electrical connection capabilities through direct application of the connection structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables cost-effective construction of power modules with enhanced thermal management and reduced thermal stresses, allowing for efficient electrical connections without a circuit carrier and improved heat dissipation.
Implementation Method 1
the encapsulation compound is a cement compound... which has good thermal conductivity
Implementation Method 2
at least one electrically conductive layer, in particular a metal layer or a layer containing at least one metal particle... which layer forms an electrically conductive connection structure
Implementation Method 3
The at least one further electronic component is electrically conductively connected, in particular soldered or sintered, to the wiring structure
Implementation Method 4
The at least one further electronic component is electrically conductively connected, in particular soldered or sintered, to the wiring structure
Data Source
AI summary
The invention relates to a power module. The power module has at least one power semiconductor and at least one further electronic component. The power module has a housing which is formed by a shaped body and is formed by an encapsulation compound. According to the invention, the housing is formed in at least two levels. At least one power semiconductor component is arranged in a first level and the at least one further electronic component is arranged in the second level. At least one electrically conductive layer, which forms an electrically conductive connecting structure, is formed on a surface of an inner boundary of the power module which extends between the levels. The connecting structure is applied directly to the surface. The at least one further electronic component is electrically conductively connected, in particular soldered or sintered, to the wiring structure. The power semiconductor component in the first level is electrically connected to the further component in the second level by means of the connecting structure.