3D Power Module Layout for Low Parasitic Inductance and Heat Dissipation
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Solution Overview
Problem
Existing power modules have large parasitic inductance and poor heat dissipation performance, which affects the reliability and efficiency of power electronic devices.
Innovation Solution
A power module design featuring a specific conductor layout with overlapping areas on reference planes, where the P and N electrode conductors have a first overlap area, and upper and lower bridge arm switches have a second overlap area, to reduce parasitic inductance and enhance heat dissipation by uniform heat distribution and reduced heat transfer resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional power module packaging is used, then manufacturing is simpler, but parasitic inductance is large and heat dissipation is poor
Solution Approach 1:
The patent transitions from planar conductor layout to three-dimensional stacked conductor layers. Multiple conductor layers are positioned at different heights (first reference plane, second reference plane, third reference plane) with vertical connections, creating a 3D current path that reduces parasitic inductance while maintaining compact footprint.
Solution Approach 2:
The patent implements nested conductor paths where inner conductors are surrounded by outer conductors in overlapping areas. The first conductor, second conductor, and third conductor are arranged concentrically with overlapping projections, creating nested current loops that minimize enclosed area and reduce parasitic inductance.
2Temperature
If conventional conductor layout is used, then manufacturing is easier, but heat dissipation performance is poor
Solution Approach 1:
The patent applies different conductor configurations to different regions: overlapping areas use nested concentric conductors for inductance reduction, while non-overlapping areas use simplified single-conductor paths. The first, second, and third conductors are selectively positioned based on local thermal and electrical requirements.
Solution Approach 2:
Heat dissipation is enhanced by distributing heat sources across multiple vertical layers. The first switches, second switches, and third switches are positioned at different reference planes with corresponding conductor layers, creating multiple heat dissipation pathways through the module thickness rather than concentrating heat in a single plane.
3Speed
If parasitic inductance is reduced through complex packaging, then switching speed improves, but manufacturing complexity increases
Solution Approach 1:
The conductor system is segmented into three distinct conductor layers (first conductor, second conductor, third conductor) positioned at different reference planes. Each layer can be manufactured and positioned independently, then assembled through vertical connections, allowing modular manufacturing that balances complexity with performance.
Solution Approach 2:
The multi-layer conductor structure serves multiple functions simultaneously: it reduces parasitic inductance through nested overlapping areas, provides thermal management pathways, and enables high-speed switching. The same structural elements achieve electrical, thermal, and mechanical objectives.
Data Source
AI summary
A power module, including: a first conductor, disposed at a first reference plane; a second conductor, disposed at a second reference plane, wherein projections of the first and second conductors on the first reference plane have a first overlap area; a third conductor, disposed at a third reference plane; a plurality of first switches and a plurality of second switches, wherein at least one of the first switches and at least one of the second switches that are located on a left side are alternatively disposed, at least one of the first switches and at least one of the second switches that are located on a right side are alternately disposed, and the left side and the right side of the first overlap area are oppositely disposed. Heat sources of the power module are evenly distributed and its parasitic inductance is low.