Power Module Inductor With External Heat Dissipation Path
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Solution Overview
Problem
Conventional small-sized power modules with high current inductors experience poor heat dissipation due to inadequate thermal conductivity between the inductor and the heat dissipation shell.
Innovation Solution
The design includes an inductor with an insulating body and a conductive body featuring pin parts and a heat dissipation part that connects to an external heat dissipation member, allowing for effective heat transfer from the inductor to the outside environment through the heat dissipation part and the external member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation shell is used to dissipate heat from the inductor, then heat dissipation function is provided, but the thermal conductivity between the inductor and heat dissipation shell is insufficient resulting in poor heat dissipation effect
Solution Approach 1:
The patent introduces a heat dissipation part as an intermediary component between the inductor coil and the external heat dissipation member. This heat dissipation part (which may be a conductive plate or shell) serves as a thermal mediator that improves heat transfer efficiency. The heat dissipation part is thermally coupled to the inductor coil and extends to contact with external heat dissipation structures, thereby resolving the insufficient thermal conductivity problem between the inductor and heat dissipation shell.
2Volume of moving object
If the inductor size is reduced for small-sized power module, then space is saved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent extends the heat dissipation part from the inductor coil in a directional manner (vertically or laterally) to create additional heat dissipation surface area in another dimension. This allows the compact inductor to maintain small footprint while providing sufficient heat dissipation capability through extended thermal pathways that project into three-dimensional space.
Solution Approach 2:
The heat dissipation function is segmented into multiple components: the heat dissipation part integrated with the inductor, external heat dissipation members, and thermal coupling structures. This segmentation allows each component to be optimized independently - the inductor remains compact while the heat dissipation system provides adequate thermal management through distributed thermal pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reducing the inductor and power module temperatures and prolonging their service life by facilitating better heat discharge compared to conventional designs.
Implementation Method 1
heat energy generated by an operation of the inductor is capable of being transferred to an outside through the heat dissipation part and the external heat dissipation member
Data Source
AI summary
An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.