Power Module Conductor Plate Layout to Prevent Insulation Peeling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The insulating layers between conductor plates and heat-dissipating members in power modules peel off due to repetitive thermal expansion and contraction, leading to a drop in heat dissipation performance.
Innovation Solution
The power module design includes specific positioning and arrangement of power semiconductor elements and conductor plates, with longer distances from certain ends of the conductor plates to the semiconductor elements, and angled tapered ends to reduce thermal stress on insulating sheet members, preventing peeling and maintaining heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conductor plates and heat-dissipating members are connected via insulating layers, then heat dissipation is enabled, but the insulating layers peel off due to thermal expansion and contraction
Solution Approach 1:
The conductor plate is designed with asymmetric tapered ends where one end has a larger width than the other end. This asymmetric geometry creates a thermal stress distribution that prevents peeling of the insulating layer at the critical bonding interface between the conductor plate and heat-dissipating member.
Solution Approach 2:
The width of the conductor plate is changed along its length, creating a gradual transition from a larger width at one end to a smaller width at the other end. This parameter change in the conductor plate geometry modifies the thermal stress distribution pattern, preventing insulating layer peeling while maintaining effective heat dissipation.
2Reliability
If power semiconductor elements are positioned centrally on conductor plates, then electrical connection is optimized, but thermal stress concentrates at the ends causing insulating layer peeling
Solution Approach 1:
The conductor plate employs asymmetric tapered ends with different widths, which redistributes the thermal stress away from the ends. This asymmetric design allows the power semiconductor elements to remain centrally positioned for optimal electrical connection while the tapered geometry prevents stress concentration that would cause insulating layer peeling.
3Volume of moving object
If module size is reduced for in-vehicle equipment, then weight and space are decreased, but heat dissipation becomes more challenging
Solution Approach 1:
The conductor plate geometry is modified with tapered ends that gradually change width, optimizing the thermal stress distribution within the compact module structure. This parameter change in the conductor plate design enables effective heat dissipation and prevents insulating layer peeling even in the reduced-size module configuration required for in-vehicle equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents peeling of insulating sheet members, ensuring high reliability and maintaining heat dissipation performance, even under conditions of increased thermal stress and reduced module size.
Implementation Method 1
heat generated from the power semiconductor element is transferred from the conductor plates to the heat-dissipating members via the insulating layers
Implementation Method 2
the power semiconductor element repeatedly generates heat as a result of its switching operations
Implementation Method 3
Components in the power module repeatedly expand and contract due to repetitive cycles of heat generation by the power semiconductor element
Data Source
AI summary
A power module includes a first conductor plate to which a first power semiconductor element is bonded, a second conductor plate to which a second power semiconductor element is bonded, the second conductor plate being disposed adjacent to the first conductor plate, a first heat-dissipating member disposed counter to the first conductor plate and the second conductor plate, and a first insulating sheet member disposed between the first heat-dissipating member and the first conductor plate. The first power semiconductor element is disposed at a position at which a first length from an end of the first conductor plate, the end being closer to the second conductor plate, to the first power semiconductor element is larger than a second length from an end of the first conductor plate, the end being far from the second conductor plate, to the first power semiconductor element, and the second length is larger than the thickness of the first conductor plate.