Plastic-Housed Power Module With Integrated Cooling Baseplate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power modules with metal cooling assemblies are heavy, costly, and have a high part count due to complex manufacturing processes, which complicates efficient cooling of semiconductor dies.
Innovation Solution
A power module design featuring a metal baseplate with an integrated cooling structure, encased in a plastic housing with a form-fit connection, eliminating the need for additional parts to attach semiconductor modules to the coolant housing, and using fiber-reinforced polymers for lightweight and high-strength materials, reducing manufacturing complexity and part count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal cooling assemblies are used in power modules, then cooling efficiency is improved, but weight increases
Solution Approach 1:
The patent employs composite material construction by integrating metal cooling channels within a plastic housing structure. This combination allows the module to benefit from the high thermal conductivity of metal for efficient cooling while the plastic housing contributes to weight reduction, thereby resolving the contradiction between cooling efficiency and weight.
2Temperature
If complex manufacturing processes are used to achieve efficient cooling, then cooling performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the housing structure and cooling assembly into a single integrated component. The cooling channels are directly formed within the housing structure during the molding process, eliminating the need for separate cooling assembly steps. This integration simplifies manufacturing while maintaining efficient cooling performance, thereby resolving the contradiction between cooling performance and manufacturing cost.
Solution Approach 2:
The cooling channels are pre-formed within the housing structure during the initial molding process before final assembly. This preliminary action ensures that the cooling infrastructure is already in place and properly positioned, eliminating the need for complex post-assembly cooling installation steps and reducing overall manufacturing complexity and cost.
3Strength
If additional parts are used to attach semiconductor modules to coolant housing, then structural integrity is improved, but part count increases
Solution Approach 1:
The patent combines the housing structure and cooling assembly into a single integrated component, eliminating the need for separate attachment parts. The cooling channels are directly formed within the housing structure, which provides both structural integrity and cooling functionality without requiring additional fasteners or connecting elements, thereby reducing part count while maintaining strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a lightweight, cost-effective power module with efficient cooling capabilities, simplified manufacturing, and reduced part count, utilizing plastic materials that are flame-resistant and compatible with typical coolants, while maintaining structural integrity and thermal performance.
Implementation Method 1
a cavity for a coolant to cool the integrated cooling structure of the at least one semiconductor module
Data Source
AI summary
The present invention relates to a power module (101) comprising at least one semiconductor module (104) having a metal baseplate (108) with an integrated cooling structure. The power module (101) further comprises a first housing part (121) made from a plastic material and molded around at least parts of the metal baseplate (108) to establish a form-fit connection with the at least one semiconductor module (104), and a second housing part (122) made from a plastic material and joined to the first housing part (121) to form a cavity for a coolant (116) for cooling the integrated cooling structure of the at least one semiconductor module (104). The present disclosure further relates to a method for manufacturing a power module (101).