Double-Sided Cooling Power Module With Integrated Substrate Spacers
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Solution Overview
Problem
Existing double-sided cooling power modules face challenges in maintaining electrical conductivity and spacing between substrates without separate spacers, which can be tilted during bonding, increase manufacturing costs, and hinder heat dissipation due to thermal overlap and wire bonding processes.
Innovation Solution
Integrally forming spacers with the substrates, eliminating the need for separate spacers, and using conductive pastes to connect metal circuits, thereby reducing manufacturing complexity and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate spacers are used to maintain space between substrates, then spacing is secured, but manufacturing complexity and costs increase
Solution Approach 1:
The spacer structure is merged with the substrate by integrally forming the spacer from the substrate material itself. The spacer extends directly from the metal circuit on the substrate surface, eliminating the need for separate spacer components and reducing manufacturing steps while maintaining precise spacing between substrates
2Reliability
If separate spacers are used for electrical conduction, then connectivity is achieved, but durability decreases due to tilting and thermal overlap consumption
Solution Approach 1:
The spacer and substrate are merged into a single integral structure where the spacer extends directly from the substrate's metal circuit. This integration eliminates the interface between separate components, preventing tilting and thermal overlap consumption that would occur at junctions, thereby enhancing electrical conduction reliability and long-term durability
Solution Approach 2:
The spacer is pre-formed as an integral part of the substrate during the substrate manufacturing process itself, rather than being added as a separate component later. This preliminary formation ensures proper alignment and structural integrity from the outset, preventing durability issues before they can occur
3Manufacturing precision
If separate spacers are used to maintain space, then spacing is secured, but heat dissipation performance decreases
Solution Approach 1:
The spacer is merged with the substrate as an integral structure made from the same conductive material. This integration creates continuous thermal pathways from the substrate through the spacer to the opposing substrate, enabling efficient heat dissipation while maintaining the necessary spacing between substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies manufacturing, reduces costs, enhances electrical connectivity, and improves thermal characteristics by minimizing spacer thickness and heat transfer paths, ensuring uniform heat distribution and increased durability.
Implementation Method 1
The double-sided cooling power module employs a via spacer to connect the different substrates and secure a space between the different substrates, and it is important where to place the via spacer due to its function of electric conduction
Implementation Method 2
A cooling layer connected to a cooler may be disposed on each of a 1-2nd surface opposite to the 1-1st surface of the first substrate and a 2-2nd surface opposite to the 2-1st surface of the second substrate
Data Source
AI summary
A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.