Submerged Jet Cooling for Power Module Die and Baseplate Heat
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Solution Overview
Problem
Existing thermal management systems for power dense electronic systems face challenges in efficiently removing heat from semiconductor dies and baseplates, leading to thermal stress and reduced device life due to high junction temperatures and reliance on thermal interface materials that increase thermal resistance.
Innovation Solution
A thermal management system utilizing a low thermal impedance baseplate combined with a submerged jet impingement assembly for direct cooling of semiconductor dies and baseplates, eliminating thermal interface materials and providing a direct fluid path for enhanced heat transfer through impinging jets and baseplate cooling channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional thermal management systems are used with thermal interface materials, then the system structure is simpler, but thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
The patent removes thermal interface materials from the thermal management system, extracting the problematic component that caused thermal resistance. The semiconductor die is directly coupled to the cooling plate, eliminating the thermal interface layer that hindered heat transfer efficiency while maintaining structural simplicity through direct contact design
Solution Approach 2:
The patent introduces a two-phase refrigerant flow system with vapor and liquid phases to enhance heat transfer. The refrigerant circulates through channels in the cooling plate, utilizing phase change mechanisms to improve thermal management efficiency without requiring thermal interface materials
2Ease of operation
If heat flux-controlled regimes are used in traditional systems, then the system operation is simpler, but temperature control stability deteriorates beyond nucleate boiling regime
Solution Approach 1:
The patent changes the thermal management approach by implementing a two-phase refrigerant system with controlled vapor and liquid phases. This parameter change enables stable temperature control through phase change mechanisms, maintaining operational stability even at high heat flux conditions beyond traditional nucleate boiling regimes
Solution Approach 2:
The patent incorporates thermal management control through the refrigerant flow system, where the two-phase refrigerant provides feedback-based temperature regulation. The phase change process naturally responds to thermal conditions, stabilizing temperature control without requiring complex external control mechanisms
3Device complexity
If single flow path cooling is used, then the system structure is simpler, but heat rejection capability is insufficient for high power density
Solution Approach 1:
The patent segments the thermal management system into distinct functional zones: a semiconductor die, a cooling plate with multiple channels, and a two-phase refrigerant flow system. This segmentation allows for optimized heat rejection pathways while maintaining manageable system complexity through modular design
Solution Approach 2:
The patent transitions from single-phase to two-phase refrigerant flow, adding a dimensional aspect to the cooling system. The vapor-liquid phase change provides an additional thermal management dimension, significantly enhancing heat rejection capability without proportionally increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves increased heat flux rejection, stable temperature control, and extended device life by establishing a secondary heat transfer pathway, reducing junction temperatures and enhancing convection coefficients, thereby supporting higher power density and efficient operation.
Implementation Method 1
a submerged jet impingement assembly for direct semiconductor die cooling, a first flow path extending over the semiconductor die via the submerged jet impingement assembly
Implementation Method 2
the fluid is directed through the inlet manifold, through the at least one delivery nozzle, and onto the upper semiconductor surface of the semiconductor die to cool the semiconductor die
Implementation Method 3
a second flow path in thermal contact with the baseplate, the flow system including a fluid flowing through the first flow path and the second flow path
Implementation Method 4
the fluid is a dielectric refrigerant
Implementation Method 5
the flow system is configured to direct the fluid to the upper semiconductor surface of the semiconductor die via the first flow path and to the baseplate via the second flow path so as to transfer heat away from the semiconductor die and from the baseplate
Data Source
AI summary
A thermal management system includes a baseplate assembly and a flow system. The baseplate assembly includes a baseplate and a semiconductor die. The flow system includes a submerged jet impingement assembly for direct semiconductor die cooling, a first flow path extending over the semiconductor die via the submerged jet impingement assembly, and a second flow path in thermal contact with the baseplate, the flow system including a fluid flowing through the first flow path and the second flow path. The flow system is configured to direct the fluid to the upper semiconductor surface of the semiconductor die via the first flow path and to the baseplate via the second flow path so as to transfer heat away from the semiconductor die and from the baseplate so as to cool the baseplate assembly.