Power Semiconductor Module With Molded DC Lead Isolation
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Solution Overview
Problem
The production of power semiconductor modules is technically complex due to the precise positioning requirements of insulation layers and lead connection elements, which hinders efficient manufacturing.
Innovation Solution
A power semiconductor module design featuring a substrate with an insulation layer and metal conductor tracks, where flat lead connection elements are encased in plastic and materially bonded, with a DC voltage connection device integrated into a plastic housing element, allowing for efficient production and reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If exact positioning of insulation layer and flat lead connection elements is implemented, then electrical insulation strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the insulation layer, flat lead connection elements, and housing element into a single integrated component. The insulation layer is formed directly on the housing element, and the flat lead connection elements are embedded into the housing element with the insulation layer, eliminating the need for separate positioning steps and reducing manufacturing complexity while maintaining electrical insulation strength.
Solution Approach 2:
The insulation layer is pre-formed on the housing element before the flat lead connection elements are positioned. This preliminary action ensures that the insulation structure is already in place, simplifying subsequent assembly steps and ensuring proper electrical insulation without requiring complex positioning operations.
2Reliability
If exact positioning of flat lead connection elements and insulation layer with respect to housing element is implemented, then electrical connection reliability is improved, but production efficiency deteriorates
Solution Approach 1:
The patent merges the insulation layer and flat lead connection elements into a single integrated component that is formed as one piece with the housing element. This integration eliminates the need for separate positioning and assembly operations, thereby improving production efficiency while ensuring reliable electrical connections through the integrated design.
Solution Approach 2:
The flat lead connection elements are pre-positioned and embedded into the housing element during the formation process, before final assembly. This preliminary positioning ensures correct spatial relationships and electrical connections are established in advance, simplifying subsequent manufacturing steps and improving overall production efficiency.
3Productivity
If plastic element encases flat lead connection element, then manufacturing efficiency is improved, but electrical insulation challenge increases
Solution Approach 1:
The patent combines the insulation layer and plastic element into a single integrated insulating structure. The insulation layer is formed on the housing element, and the plastic element is molded over the flat lead connection element, with both structures working together as a unified insulating system. This integration maintains electrical insulation effectiveness while enabling efficient manufacturing through combined molding operations.
Solution Approach 2:
The patent uses a composite insulating structure consisting of the insulation layer (electrically non-conducting material) and the plastic element (molded material). This composite approach provides robust electrical insulation through the combination of different materials, while the plastic element's molding process enables efficient manufacturing. The two materials work together to provide both insulation and structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient and stable production of power semiconductor modules with high electrical insulation strength and low inductance, facilitating easy connection to heat sinks or baseplates, thus improving manufacturing efficiency and reliability.
Implementation Method 1
the first flat lead connection element is materially bonded to the plastic element by injection-moulding technology, in particular being injection-moulded into the plastic element
Implementation Method 2
the housing element is formed from a plastic, and the DC voltage connection device is materially bonded to the housing element by the DC voltage connection device being materially bonded to the housing element by injection-moulding technology, in particular being injection-moulded into the housing element
Data Source
AI summary
A power semiconductor module includes a substrate, having power semiconductor components, further including a housing element, and having a DC voltage connection device having a flat lead connection device and a second flat lead connection element, wherein the flat lead connection device has a first flat lead connection element encased by a plastic element of the flat lead connection device and materially bonded to the plastic element, wherein a connection section of the first flat lead connection element projects from the plastic element, a connection section of the second flat lead connection element is arranged on the plastic element or is at least partly enclosed by the plastic element and bonded to the plastic element so that a section of the plastic element is between the first flat lead connection element and the connection section of the second flat lead connection element.