Intelligent Power Module Lid Integration for Assembly Complexity
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Solution Overview
Problem
Existing intelligent power modules face challenges with high assembly complexity, low input/output count, large gold usage, poor electrical performance, and reliability issues due to the limitations of wire bonding and clip bonding techniques, which also require new modules for control circuit changes, increasing production costs.
Innovation Solution
The intelligent power module employs press-fit connectors integrated into the lid, eliminating one level of wire bonding by positioning press-fits on the case body and using metalized through-holes for electrical connections, allowing the control circuit board to be integrated within the lid, thereby reducing assembly complexity and enabling easier module modifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding or clip bonding techniques are used to connect control circuit board and power circuit board, then electrical connections can be established, but assembly complexity increases and production costs increase
Solution Approach 1:
The patent merges the control circuit board with the lid structure by integrating mounting holes directly into the lid. This integration eliminates the need for separate bonding operations (wire bonding or clip bonding) to connect the control circuit board to the power circuit board, as both are now mounted on the same structural component. The control circuit board is secured to the lid through integrated mounting holes, creating a unified assembly that reduces overall complexity while maintaining reliable electrical connections.
Solution Approach 2:
The lid is designed with multi-functionality, serving both as the protective cover and as the mounting structure for the control circuit board. The mounting holes are integrated into the lid structure itself, allowing the lid to simultaneously provide mechanical protection and electrical connection support. This universal design eliminates the need for separate bonding components and processes, reducing assembly complexity while ensuring reliable electrical connections between circuits.
2Reliability
If wire bonding techniques are used for electrical connections, then connections can be made, but gold usage increases and electrical performance deteriorates
Solution Approach 1:
The patent extracts the bonding wires and associated gold materials from the assembly by eliminating the wire bonding process entirely. Instead of using gold wires to connect the control circuit board to the power circuit board, the design relies on direct mounting through the integrated holes in the lid. This extraction of the wire bonding step removes the need for gold consumption while maintaining connection reliability through the structural integration of the mounting system.
3Reliability
If wire bonding or clip bonding is used to connect control and power circuit boards, then electrical connections are established, but any control circuit changes require new modules, increasing production costs
Solution Approach 1:
The patent segments the control circuit board from the power circuit board by mounting them separately on different structures (control circuit board on the lid, power circuit board on the base). This segmentation allows the control circuit board to be independently accessed, removed, or modified without affecting the power circuit board. The integrated mounting holes in the lid provide stable electrical connections while enabling easy replacement or modification of the control circuit, thus improving adaptability without compromising connection reliability.
Data Source
AI summary
An intelligent power module includes a power circuit board having a plurality of power devices and fixed on a base plate of a case body able to be closed with a lid to form a protective case of the intelligent power module. The intelligent power module also includes a control circuit board suitable to drive the power devices of the power circuit board. The control circuit board is associated with the lid in such a way that the control circuit board is comprised within the case body. The control circuit board and the lid thus realizing an intelligent lid of the intelligent power module.