Power Module Connection Assembly for Multi-Sided Liquid Cooling
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Solution Overview
Problem
Conventional power electronic devices face challenges in efficient cooling due to fragile wire or ribbon bonding, which restricts heat extraction and prevents easy double-sided cooling or stacking of power modules.
Innovation Solution
The proposed solution involves a housing with structures for an insertable interconnection arrangement and conductor support for power module components, utilizing direct liquid impingement cooling on multiple sides of the device, and a modular design that allows for improved thermal management and increased power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If wire or ribbon bonding is used for interconnection, then electrical connections are established, but heat extraction is restricted and cooling efficiency deteriorates
Solution Approach 1:
The patent removes the wire or ribbon bonding interconnection structure entirely and replaces it with direct conductive member connections. The conductive members extend directly from the power semiconductor devices through the substrate to the cooling structure, eliminating the fragile wire bonds that were restricting heat extraction paths.
Solution Approach 2:
The patent transitions from planar two-dimensional cooling to three-dimensional multi-sided cooling. By extending conductive members vertically through the substrate and implementing cooling structures on multiple sides of the power module, the patent enables heat extraction from previously inaccessible surfaces, dramatically improving thermal management.
2Adaptability or versatility
If conventional power module packaging is used, then power components are contained, but double-sided cooling or stacking is prevented
Solution Approach 1:
The patent divides the power module into separable components: the power electronic substrate with mounted devices, and the cooling structure. The conductive members extend through the substrate, allowing the cooling structure to be attached to multiple sides independently. This segmentation enables flexible cooling configurations including double-sided cooling and stacking arrangements that were previously impossible with conventional sealed packaging.
3Power
If traditional cooling methods are used, then heat removal is achieved, but power density is limited due to inefficient thermal management
Solution Approach 1:
The patent replaces the mechanical wire bonding system with a direct conductive connection system that simultaneously provides both electrical interconnection and thermal conduction. The conductive members serve dual functions as both electrical conductors and heat sinks, creating efficient heat extraction paths directly from the power semiconductor devices to the cooling structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more efficient heat extraction and improved cooling performance compared to traditional methods, allowing for higher power densities and more compact power electronics systems.
Implementation Method 1
The proposed solution involves a housing with structures for an insertable interconnection arrangement and conductor support for power module components, utilizing direct liquid impingement cooling on multiple sides of the device
Implementation Method 2
a first conductive member (71) and a second conductive member (72) extending from the housing (12), the first and second conductive members (71, 72) electrically coupled to the electronic component (14)
Data Source
AI summary
The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.