Power Module Cooling Loop Layout for Even Switch Temperature
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Solution Overview
Problem
Existing power electronics devices, such as inverters, face inefficiencies in heat dissipation, leading to uneven cooling of electronic switches, which can result in premature failure and total system failure due to insufficient cooling.
Innovation Solution
A power module design with a base plate and attached cooling devices featuring loops that are inclined and/or protrude differently, creating turbulence in the cooling fluid flow to enhance cooling performance and ensure even cooling across switches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If loop-shaped cooling devices are arranged in the coolant flow, then heat dissipation is improved, but the cooling is insufficient and switches are cooled unevenly
Solution Approach 1:
The patent applies asymmetry by inclining the loops of cooling devices at different angles relative to the base plate. Specifically, cooling devices in a first group have loops inclined at a first angle, while cooling devices in a second group have loops inclined at a second angle. This asymmetric arrangement creates different flow resistance characteristics for the coolant passing through different regions, thereby achieving more uniform heat dissipation across all electronic switches.
Solution Approach 2:
The patent implements local quality by varying the loop inclination angles and protrusion distances of cooling devices according to the specific thermal requirements of different electronic switches. Each cooling device can be customized with specific loop characteristics to match the local heat generation patterns, ensuring that each switch receives appropriate cooling attention.
2Temperature
If loop-shaped cooling devices are arranged in the coolant flow, then heat dissipation is improved, but the rated power is significantly limited
Solution Approach 1:
By using asymmetric loop inclinations, the patent improves the overall heat dissipation efficiency of the cooling system. This allows the inverter to operate at higher rated powers without exceeding temperature limits, as the coolant can more effectively remove heat from all switches including those in high-power regions.
3Temperature
If switches are cooled to different degrees, then heat dissipation is achieved, but insufficiently cooled switches fail prematurely
Solution Approach 1:
The asymmetric loop arrangement ensures that coolant flow and heat dissipation are optimized for each switch's specific thermal load. This prevents any single switch from being under-cooled, thereby eliminating the reliability issue of premature switch failure while maintaining effective heat dissipation across the entire power module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced cooling design improves heat dissipation, preventing premature switch failure and ensuring consistent operation of the power electronics device.
Implementation Method 1
The proposed measures lead to an increased turbulence in the cooling medium and thus to an improved cooling performance
Implementation Method 2
the cooling devices, in particular the loops thereof, are in contact with the cooling fluid or heat transfer medium
Implementation Method 3
a cooling fluid flows in a main flow direction from the inlet to the outlet
Data Source
AI summary
A power module for an inverter is disclosed. The power module has a base plate with a first base plate side and a second, opposite base plate side, controllable electronic switches arranged on the first base plate side, inputs and outputs, which are electrically connected to the electronic switches. The power module is designed to convert an input voltage applied to the inputs to an output voltage applied to the outputs by the electronic switches. The power module also includes a plurality of cooling devices attached to the second base plate side. The cooling devices each have loops arranged one behind the other. The loops of a first group of cooling devices are inclined with respect to the loops of a second group of cooling devices, and/or the loops of each group of cooling devices protrude from the second base plate side to different distances.