Power Module Layout With Integrated Magnetic Assembly Cooling
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Solution Overview
Problem
Conventional power modules face increased power loss and inadequate heat dissipation due to thermal resistance issues when the voltage regulator module and central processing unit are disposed on opposite surfaces of the system board, leading to inefficient heat conduction to the electronic device case.
Innovation Solution
A power module design featuring a heat-dissipating substrate with a thermal contact surface, a power circuit with switch elements connected to the substrate, and a magnetic assembly with electrical conductors that pass through holes in a magnetic core module, reducing thermal resistance and allowing for effective heat dissipation and reduced power loss by using the conductors as windings for output inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the voltage regulator module and central processing unit are disposed on opposite surfaces of the system board to increase dynamic performance and main frequency, then the path between output of voltage regulator module and central processing unit is shortened, but the thermal resistance between power module thermal sources and the case increases, resulting in inadequate heat dissipation
Solution Approach 1:
The patent transitions from a planar heat dissipation approach to a three-dimensional heat dissipation structure by disposing power elements on both the top and bottom surfaces of the magnetic core. This spatial arrangement creates multiple thermal conduction paths simultaneously, allowing heat to be conducted to the case through both surfaces, thereby reducing thermal resistance while maintaining the short electrical path between voltage regulator module and CPU on opposite board surfaces.
Solution Approach 2:
The magnetic core is divided into multiple segments with power elements disposed on different surfaces and regions. This segmentation creates independent thermal conduction paths from different power elements to the case, preventing thermal bottlenecks and improving overall heat dissipation efficiency while maintaining electrical performance.
2Device complexity
If conventional power module structure is used with power elements on printed circuit board, then the structure is simple, but the thermal resistance between thermal sources and case is large, and power loss in output inductors is increased
Solution Approach 1:
The patent merges the magnetic core with the heat dissipation function by integrating power elements directly onto the magnetic core surfaces. This combination eliminates the need for separate heat dissipation components while reducing thermal resistance, as the magnetic core itself becomes the primary heat conduction path to the case, thereby reducing power loss without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces power loss in output inductors, enhances thermal conductivity, and increases power density by allowing heat to be efficiently conducted to the electronic device case, while maintaining suitable inductance levels.
Implementation Method 1
the heat generated from the at least one switch element is conducted to the heat-dissipating substrate through the thermal contact surface and dissipated by the heat-dissipating substrate
Implementation Method 2
The magnetic assembly comprises at least one first electrical conductor and a magnetic core module comprising at least one hole
Data Source
AI summary
A power module includes a power circuit and a magnetic assembly. The power circuit includes at least one switch element. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The power circuit and the magnetic assembly are arranged in sequence along a same direction.