Power Module Encapsulation Layout for Stress-Free Magnetic Components
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Solution Overview
Problem
Conventional power modules experience increased power loss and parameter changes in magnetic components due to stress generated by encapsulation materials, leading to instability and performance issues.
Innovation Solution
A manufacturing method for power modules that involves forming encapsulation layers on substrates without overlapping projections of the encapsulation layer with magnetic components, creating gaps between the encapsulation layer and the magnetic component peripheries, thereby preventing stress-induced performance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the magnetic component is completely encapsulated in the encapsulation material, then the structural stability is improved, but the power loss of the magnetic component increases and parameters change due to stress
Solution Approach 1:
The encapsulation structure is segmented into two parts: the encapsulation material that covers the circuit board and electronic components, and the magnetic component that remains exposed. This segmentation allows the circuit board assembly to be protected while the magnetic component operates without encapsulation-induced stress, resolving the contradiction between structural stability and power loss.
Solution Approach 2:
The magnetic component is extracted from the encapsulation material, creating a gap between the two. This extraction eliminates the harmful stress interaction between the encapsulation material and magnetic component, preventing parameter changes and reducing power loss while maintaining overall module stability.
2Reliability
If the magnetic component is completely encapsulated in the encapsulation material, then the protection is improved, but the parameters of the magnetic component change due to stress
Solution Approach 1:
The encapsulation is segmented to exclude the magnetic component, allowing it to maintain its parameters without stress-induced changes from the encapsulation material.
Solution Approach 2:
The magnetic component is taken out from the encapsulation material, ensuring its parameters remain stable and unchanged while the rest of the module receives protective encapsulation.
3Ease of manufacture
If the encapsulation material is applied over the entire assembly, then the manufacturing simplicity is improved, but the stress generation increases causing performance degradation
Solution Approach 1:
The encapsulation process is segmented into two stages: first encapsulating the circuit board and electronic components, then separately positioning the magnetic component in the working region without encapsulation. This approach maintains manufacturing simplicity while eliminating stress generation.
Solution Approach 2:
The magnetic component is positioned in the working region before the encapsulation material is applied, preventing stress generation from the outset while maintaining a streamlined manufacturing process.
Data Source
AI summary
The present disclosure provides a manufacturing method of a power module, including steps of: (a) providing a substrate, wherein the substrate comprises a first surface, a second surface and at least one working region, the first surface and the second surface are opposite to each other, and the at least one working region is disposed on the first surface or the second surface; (b) providing an electronic component disposed on the substrate; (c) forming an encapsulation layer disposed on the substrate and covering the electronic component, wherein a projection of the encapsulation layer on the first surface of the substrate is not overlapped with a projection of the working region on the first surface of the substrate; and (d) providing a magnetic component disposed on the working region of the substrate, so that the encapsulation layer at least partially surrounds a lateral periphery of the magnetic component, wherein a gap is formed between the encapsulation layer and the lateral periphery of the magnetic component.