Power Module Assembly Thermal Dissipation via Metal Block
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Solution Overview
Problem
High-power DC/DC power modules face challenges in heat dissipation due to increasing power density, leading to complex and costly manufacturing processes, particularly with conventional methods using thermal pads and heat sinks.
Innovation Solution
A power module assembly that includes a circuit board with heat-generating devices, metal blocks, and filling materials to optimize heat dissipation by stacking metal blocks on heat-generating devices and attaching them to substrates, reducing thermal resistance and design complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional methods using thermal pads and heat sinks are used for heat dissipation, then heat dissipation function is provided, but manufacturing process complexity and cost increase
Solution Approach 1:
The patent merges the heat dissipation function directly into the substrate by forming a heat dissipation cavity within the substrate structure itself. This eliminates the need for separate thermal pads and heat sinks, reducing manufacturing process complexity while maintaining effective heat dissipation capability through the integrated cavity design that allows direct thermal coupling with power device bottoms.
Solution Approach 2:
The patent extracts the heat dissipation function from traditional separate components (thermal pads and heat sinks) and integrates it into the substrate structure. By taking out the need for these additional components and incorporating the heat dissipation cavity directly into the substrate, the manufacturing process is simplified while the heat dissipation function is preserved.
2Productivity
If power density is increased to improve efficiency, then power module efficiency improves, but heat dissipation problem worsens
Solution Approach 1:
The patent transitions from traditional planar heat dissipation to three-dimensional heat dissipation by forming a heat dissipation cavity within the substrate. This dimensional change allows heat to be dissipated through multiple surfaces and pathways simultaneously, enabling effective heat management at higher power densities without compromising power module efficiency.
3Temperature
If thermal pad or thermal adhesive is used to connect heat sink, then heat transfer is achieved, but processing complexity and manufacturing threshold increase
Solution Approach 1:
The patent removes the need for thermal pads or thermal adhesives by directly integrating the heat dissipation cavity into the substrate. This extraction of intermediate thermal interface materials simplifies the manufacturing process and reduces the technical threshold required for production, while maintaining effective heat transfer through the direct cavity structure.
Solution Approach 2:
The patent combines the substrate and heat dissipation function into a single integrated structure. By merging these functions and eliminating the need for separate thermal interface materials like thermal pads or adhesives, the manufacturing process becomes simpler and more accessible, reducing both processing complexity and manufacturing threshold.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation capability and improves power density while simplifying the manufacturing process, reducing costs and design complexity, and facilitating efficient thermal and electrical connections.
Implementation Method 1
The first filling material is disposed between the first side of the first metal block and the at least one heat-generating device
Implementation Method 2
The second filling material is disposed between the second side of the first metal block and the substrate
Implementation Method 3
The first metal block includes a first side and a second side. The first side of the first metal block faces the at least one heat-generating device, and the second side of the first metal block faces the substrate
Data Source
AI summary
A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.