Dual-Sided Power Module With Embedded Metal Block
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Solution Overview
Problem
The increasing power dissipation in power semiconductor modules, particularly in electric vehicle systems, poses a significant overheating problem due to the limitations of single-sided cooling methods, which can impact efficiency and safety.
Innovation Solution
A power module design featuring dual-sided heat dissipation using a circuit board with a metal block embedded within, connected to both sides for thermal and electrical conductivity, along with first and second heat-conduction and insulation substrates to effectively transfer heat from the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If single-sided cooling type power module is used, then manufacturing cost is reduced and structure is simplified, but heat dissipation capability is insufficient leading to overheating problems
Solution Approach 1:
The power module is divided into two independent cooling paths: a first cooling path from the first surface of the circuit board through the first heat-conduction and insulation substrate, and a second cooling path from the second surface through the second heat-conduction and insulation substrate. This segmentation allows heat to be dissipated through multiple separate channels simultaneously, resolving the contradiction between simplified structure and heat dissipation capability.
Solution Approach 2:
The invention transitions from single-sided cooling to dual-sided cooling by utilizing both the first surface and the second surface of the circuit board for heat dissipation. This dimensional change from one-sided to two-sided heat dissipation effectively doubles the heat dissipation area and capability while maintaining a compact module structure.
2Power
If power density is increased in electric vehicle systems, then system integration is improved, but heat generation increases making heat dissipation more difficult
Solution Approach 1:
The heat dissipation function is segmented into two independent paths operating simultaneously. The first cooling path handles heat from the first surface while the second cooling path handles heat from the second surface, allowing the system to manage higher power densities by distributing thermal load across multiple channels.
Solution Approach 2:
The invention combines multiple heat dissipation functions into a single integrated power module structure. By integrating both cooling paths within one module, the system achieves high power density with effective heat management, resolving the contradiction between increased power and heat dissipation challenges.
3Volume of moving object
If limited vehicle body space is used, then space utilization is improved, but heat dissipation area is constrained
Solution Approach 1:
The invention utilizes both surfaces of the circuit board for heat dissipation, effectively doubling the heat dissipation area within the same module footprint. This dimensional approach allows compact module size while providing sufficient heat dissipation area for high power applications in limited vehicle body space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reduces manufacturing costs, and minimizes the risk of overheating in compact spaces, improving the operational reliability and safety of power electronics systems.
Implementation Method 1
The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block
Implementation Method 2
The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip
Data Source
AI summary
A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.