Power Module Metal Pattern Insulating Substrate Thermal Resistance
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Solution Overview
Problem
Power modules for semiconductor devices face high thermal resistance and size issues due to thick substrates and complex processes involving lead frames and insulating substrates, leading to increased process complexity and power loss.
Innovation Solution
Replacing lead frames with metal patterns on insulating substrates to reduce the thickness of power semiconductor module packages and simplify the packaging process, thereby reducing thermal resistance and eliminating the need for separate heat spreaders and conductive wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead frames and insulating substrates are used in a power semiconductor package, then electrical connection is achieved, but process complexity increases and bonding losses occur
Solution Approach 1:
The patent merges the lead frame and insulating substrate into a single integrated structure where the metal pattern is directly formed on the insulating substrate. This eliminates the separate bonding process between lead frame and substrate, reducing process complexity while maintaining electrical connection functionality.
Solution Approach 2:
The patent extracts the lead frame as a separate component and replaces it with a metal pattern directly formed on the insulating substrate. This removes the unnecessary lead frame component and its associated bonding processes, simplifying the overall package structure.
2Reliability
If lead frames and insulating substrates are bonded, then electrical connection is established, but bonding losses are generated
Solution Approach 1:
The metal pattern is directly formed on the insulating substrate through deposition processes, eliminating the separate bonding step between lead frame and substrate. This direct integration removes the bonding loss entirely while establishing electrical connection.
3Strength
If thick substrates are used for power modules, then structural strength is maintained, but module size increases
Solution Approach 1:
The patent uses a composite structure combining insulating substrate with metal pattern, eliminating the need for thick substrates. The metal pattern provides necessary electrical pathways while the thin insulating substrate maintains structural integrity, achieving both strength and size reduction.
4Reliability
If conventional packaging processes are used, then complete assembly is achieved, but manufacturing costs increase
Solution Approach 1:
The patent removes unnecessary components (separate lead frame, heat spreader, conductive wires) from the conventional packaging process. This component reduction directly lowers material costs and simplifies manufacturing while maintaining complete assembly functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach decreases thermal resistance, reduces the overall thickness of power modules, and simplifies the manufacturing process while saving costs by omitting unnecessary components, resulting in improved heat sink efficiency and reduced power loss.
Implementation Method 1
decreases thermal resistance... resulting in improved heat sink efficiency
Implementation Method 2
disposing and bonding a second surface of the insulating substrate under and with the power semiconductor chip
Data Source
AI summary
Provided are a power module having an integrated power semiconductor and a method of packaging the same. The power module according to an aspect of the present invention includes a power semiconductor chip based on silicon and insulating substrates respectively disposed at both surfaces of the power semiconductor chip and including a metal pattern electrically and directly connected to the power semiconductor chip.