Power Module Metal Block Recess for Heat and Noise Control
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Solution Overview
Problem
Existing power conversion devices face challenges in effectively suppressing noise, dissipating heat, and ensuring fire resistance due to the configuration of substrates and heat sinks.
Innovation Solution
A module unit is designed with a wiring substrate, a power element-embedded substrate, and a metal block that covers at least a portion of the power element-embedded substrate, featuring a recessed portion to house the substrate and enhance thermal connection and noise suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional substrate and heat sink configuration is used, then the device structure is simple, but noise suppression, heat dissipation, and fire resistance are insufficient
Solution Approach 1:
The patent merges the substrate and heat sink into an integrated metal block structure where the substrate is embedded within the metal block. This integration simultaneously achieves noise suppression through the enclosed cavity, effective heat dissipation through direct thermal contact, and fire resistance through the metal construction, while resolving the technical contradiction between reliability improvement and device complexity
Solution Approach 2:
The substrate is nested within the metal block, with the substrate positioned inside a recessed portion of the metal block. This nesting arrangement allows the substrate to be surrounded by the metal structure for noise suppression and thermal management, while the metal block itself serves as both structural support and heat dissipation pathway, effectively resolving the contradiction between enhanced reliability and structural simplicity
2Temperature
If a conventional substrate and heat sink configuration is used, then the device structure is simple, but heat dissipation is insufficient
Solution Approach 1:
The substrate and heat sink are merged into a single integrated metal block structure. The metal block serves dual functions as both substrate support and heat dissipation pathway, with thermal pathways directly integrated into the metal structure. This eliminates the need for separate heat sink components while achieving superior heat dissipation, resolving the technical contradiction between heat dissipation performance and device complexity
Solution Approach 2:
The metal block acts as an intermediary between the substrate and the external environment, providing both mechanical support and thermal management. The metal block's high thermal conductivity enables efficient heat transfer from the substrate to the external environment, while its structural integrity maintains electrical isolation, effectively resolving the contradiction between heat dissipation and structural simplicity
3Reliability
If a conventional substrate and heat sink configuration is used, then the device structure is simple, but fire resistance is insufficient
Solution Approach 1:
The substrate and heat sink are merged into an integrated metal block structure where the metal construction provides inherent fire resistance. The metal block encloses the substrate, creating a fire-resistant barrier while maintaining thermal management capabilities. This integration achieves fire resistance without requiring additional fire suppression components, resolving the technical contradiction between reliability improvement and device complexity
Solution Approach 2:
The metal block structure combines the substrate material with metal in a composite arrangement. The metal portion provides fire resistance and structural integrity, while the substrate portion maintains electrical and electronic functions. This composite construction achieves fire resistance at the system level without compromising substrate performance, effectively resolving the contradiction between fire resistance and structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module unit achieves improved heat dissipation, noise suppression, and enhanced fire resistance by integrating the power element-embedded substrate with the metal block, while allowing for flexible design and reduced inductance.
Implementation Method 1
a metal block disposed on a side of the wiring substrate on which the power element-embedded substrate is mounted, the metal block covering at least a portion of the power element-embedded substrate
Implementation Method 2
the metal block having a recessed portion on a side thereof facing the power element-embedded substrate, at least a portion of the power element-embedded substrate located in the recessed portion
Data Source
AI summary
Provided is a module unit including: a wiring substrate; a power element-embedded substrate mounted on the wiring substrate; and a metal block disposed on a side of the wiring substrate on which the power element-embedded substrate is mounted, the metal block covering at least a portion of the power element-embedded substrate, the metal block having a recessed portion on a side thereof facing the power element-embedded substrate, at least a portion of the power element-embedded substrate is located in the recessed portion.