Encapsulated Power Semiconductor Module Layout for Moisture Resistance
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Solution Overview
Problem
Power semiconductor modules are expensive and prone to damage from moisture, necessitating a cost-effective solution with enhanced moisture resistance.
Innovation Solution
A power semiconductor module arrangement comprising individual semiconductor devices on a lead frame with a molding material and a casting compound that encloses the devices, along with a frame and casting compound filling the module's capacity, providing protection and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional semiconductor module arrangements with substrate layers and metallization layers are used, then the module provides functional semiconductor operation, but the production costs are high
Solution Approach 1:
The patent combines multiple semiconductor devices (IGBTs, diodes) with their respective lead frames into a single integrated module structure. The molding material encapsulates all devices and lead frames together, eliminating the need for separate substrate layers and metallization layers for each device, thereby reducing production costs while maintaining functionality
Solution Approach 2:
The single molding material serves multiple functions: it encapsulates and protects the semiconductor devices, provides structural support, replaces traditional substrate layers, and enables cost-effective mass production. This multi-functional approach reduces the number of components and manufacturing steps required
2Reliability
If conventional housing structures are used to enclose semiconductor devices, then the module is protected, but moisture can still enter and damage the semiconductor elements
Solution Approach 1:
The molding material forms a continuous, encapsulating shell around the semiconductor devices and lead frames. This flexible yet protective coating completely seals the internal components from moisture and environmental contaminants, providing superior moisture resistance compared to conventional housing structures
Solution Approach 2:
The use of molding material as an encapsulating compound creates a composite structure where the semiconductor devices, lead frames, and molding material work together as an integrated unit. This composite approach provides both mechanical support and environmental protection, preventing moisture ingress while maintaining device functionality
Data Source
AI summary
A power semiconductor module arrangement includes two or more individual semiconductor devices arranged on a base layer. Each semiconductor device includes a lead frame, a semiconductor body arranged on the lead frame, and a molding material enclosing the semiconductor body and at least part of the lead frame. A frame is arranged on the base layer such that the frame surrounds the two or more individual semiconductor devices. A casting compound at least partly fills a capacity formed by the base layer and the frame, such that the casting compound at least partly encloses the two or more individual semiconductor devices.