Semiconductor Power Module Erroneous Mounting Detection

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Solution Overview

Problem

The challenge in semiconductor power modules is the incorrect mounting of packages with different rated currents, leading to potential overcurrent states and product failures, which existing methods like visual label checking are inefficient and time-consuming.

Innovation Solution

A semiconductor power module configuration that includes a switching unit to select and output status or identification signals, allowing for easier detection of erroneous mounting by a micro control unit, facilitating automatic recognition and prevention of incorrect installations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If visual label checking is used to detect erroneous mounting, then mounting errors can be detected, but the detection process is time-consuming and labor-intensive

Engineering Contradiction:

Improvedetection accuracyVSAvoiddetection time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the mechanical/visual inspection system with an electronic signal-based detection system. The power module includes an identification signal output unit that automatically outputs identification information, allowing the control device to electronically verify module identity without manual visual inspection, thereby reducing detection time while maintaining reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The power module performs self-identification by automatically outputting its own identification signal. This eliminates the need for external manual verification, as the module itself provides the information needed for error detection, reducing both time and labor requirements while ensuring accurate detection

Inventive Principle:

Principle #25Self-service

2Ease of manufacture

If all packages have the same shape, then manufacturing and mounting are simplified, but erroneous mounting cannot be easily detected

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidmounting error detection difficulty

Core Design Contradiction:

Ease of manufactureVSDifficulty of detecting and measuring

Solution Approach 1:

The patent introduces an identification signal as an intermediary element that carries information about the module's identity. This signal acts as a mediator between the physically identical modules and the control system, enabling the control device to distinguish between different modules and detect mounting errors even when packages have the same shape

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The identification signal creates a digital copy or representation of the module's identity information. This copied information allows the control system to verify the correct mounting of modules without needing physical differences, maintaining manufacturing simplicity while enabling error detection through information comparison

Inventive Principle:

Principle #26Copying

Data Source

PatentUS9831816B2Semiconductor power module and drive system for electric motor

Publication Date: 2017.11.28 RENESAS ELECTRONICS CORP

AI summary

Erroneous mounting of a semiconductor power module can be more easily detected. A semiconductor power module (9) according to the present invention includes: a status signal generation unit (90) configured to detect a status in the semiconductor power module (9) and generate and output a status signal indicating the detected status; an identification information storage unit (91) configured to preliminarily store identification information for identifying the semiconductor power module (9) and output an identification signal indicating the identification information; and a switching unit (92) configured to select one of the status signal output from the status signal generation unit (90) and the identification signal output from the identification information storage unit (91) and output the selected signal to an outside of the semiconductor power module (9).