Power Module with Orthogonal PCB and Heat Sink
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Solution Overview
Problem
Conventional power modules are complex to manufacture, often designed for specific applications, and require significant installation space or expensive components, making them difficult to scale or adapt to different requirements.
Innovation Solution
A power module design featuring packaged power semiconductors with electrically conductive connection elements and a heat removal area, thermally connected to a heat sink, and a printed circuit board arranged orthogonally, allowing for simple assembly and efficient cooling, using standard components and minimizing installation space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional power modules use complex designs with multiple assembly steps, then manufacturing precision can be maintained, but device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent combines multiple functions into a single integrated circuit board assembly. The printed circuit board serves simultaneously as the mounting substrate for power semiconductor devices, the heat sink mounting interface, and the electrical connection network. This merging eliminates the need for separate assembly steps for mounting devices to intermediate substrates and then to heat sinks, thereby reducing device complexity while maintaining manufacturing precision through standardized PCB fabrication processes.
Solution Approach 2:
The printed circuit board is designed as a multi-functional component that performs electrical connection, mechanical support, and thermal management functions. Power semiconductor devices are electrically connected to the PCB through soldering, mechanically supported by the PCB structure, and thermally managed through the PCB's connection to the heat sink. This universal design reduces the number of specialized components needed, simplifying the overall module design while maintaining precise manufacturing capabilities.
2Reliability
If power modules are designed for specific applications with customized configurations, then performance requirements can be met, but adaptability to other applications and scalability are reduced
Solution Approach 1:
The power module design segments the system into standardized, independently replaceable components: power semiconductor devices, printed circuit board, and heat sink. Each segment can be independently selected and configured for specific application requirements. The standardized interfaces between segments (electrical connections through PCB traces, thermal connections through the heat sink interface) allow different combinations of components to be assembled for different applications, maintaining reliable performance while enabling adaptability and scalability.
Solution Approach 2:
The design allows for parameter changes in power semiconductor device ratings, PCB trace configurations, and heat sink dimensions to accommodate different application requirements. The standardized platform supports varying power levels, voltage ratings, and thermal management needs by simply changing the specifications of individual components rather than redesigning the entire module, thus maintaining application-specific performance while enabling scalability across different power levels and uses.
3Reliability
If conventional power modules use traditional assembly methods with intermediate substrates, then electrical connections can be established, but manufacturing effort and installation space requirements increase
Solution Approach 1:
The patent merges the electrical connection function and mechanical mounting function into a single printed circuit board assembly process. Power semiconductor devices are directly soldered to the PCB, eliminating the need for intermediate substrates or separate mounting steps. This single integrated process reduces manufacturing effort and complexity while maintaining reliable electrical connections through proven PCB soldering techniques. The PCB serves as both the electrical interconnection network and the mechanical support structure.
Solution Approach 2:
The design extracts and eliminates unnecessary intermediate substrates and complex assembly fixtures from the manufacturing process. By using the printed circuit board as the primary mounting and connection platform, the patent removes multiple assembly steps involving intermediate carriers, alignment fixtures, and separate bonding operations. This extraction of unnecessary elements simplifies manufacturing while maintaining reliable electrical and thermal connections through the streamlined PCB-based architecture.
4Ease of operation
If power modules require large installation space for complex assemblies, then component accessibility is improved, but space efficiency and integration density are reduced
Solution Approach 1:
The design implements a nested arrangement where power semiconductor devices are mounted directly on the printed circuit board, which is in turn mounted on the heat sink. This nested configuration maximizes space utilization by placing components in close proximity to their functional interfaces. The vertical stacking of functions (electrical connection layer, mechanical support layer, thermal management layer) reduces the horizontal footprint while maintaining accessibility through strategic placement of connection points and service interfaces on the module exterior.
Solution Approach 2:
The patent transitions from a horizontal spread-out assembly to a vertical integrated structure. The printed circuit board provides a compact platform where electrical connections, mechanical support, and thermal management are stacked in the vertical dimension rather than spread out horizontally. This dimensional reorganization reduces the module's footprint area while maintaining component accessibility through optimized trace routing, connection point placement, and service interface design on the module's external surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, enables efficient cooling, and allows for easy adaptation to various applications by using standard semiconductor devices, reducing costs and space requirements while maintaining robustness and reliability.
Implementation Method 1
each of the packaged power semiconductors is arranged on a cooling surface of the heat sink and has its heat removal area connected to the cooling surface of the heat sink so as to be able to conduct heat
Data Source
AI summary
A power module has a plurality of packaged power semiconductors, a printed circuit board, a heat sink, and possibly a sealing compound. The power semiconductors have electrically conductive connection elements and heat removal areas on respective outer sides. The power semiconductors are arranged on a cooling surface of the heat sink and has its heat removal area connected to the cooling surface of the heat sink to conduct heat, and the printed circuit board is arranged on a side of the power semiconductors that is opposite the heat sink in an orthogonal direction, wherein the connection elements of the power semiconductors make electrical contact with pads on the printed circuit board regions, for example, laterally beside an edge of the heat sink, in which a projection of the heat sink onto the printed circuit board in the orthogonal direction does not cover the connection elements.