Power Module Package Opening for Vertical Capacitor Mounting
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Solution Overview
Problem
High power integrated power modules face challenges in reducing package size and increasing power density due to the need for additional spacing caused by heavy aluminum wedge bonding, which limits the use of common platforms for multiple products with different specifications and component sizes.
Innovation Solution
The electronic device features a package structure with an opening that exposes electronic components, allowing for the use of tall and wide components while enabling high current connections via wedge bonding, and facilitates the use of common platforms for multiple products by allowing installation of capacitors after wire bonding, thus reducing package size and increasing power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heavy aluminum wedge bonding is used for high current connections, then reliable electrical connection is achieved, but additional spacing is required between terminal connection points and adjacent components
Solution Approach 1:
The patent moves the capacitor from the horizontal plane to the vertical dimension by positioning it above the substrate surface. The capacitor leads extend vertically through openings in the molding compound, allowing the capacitor to be mounted in the Z-direction rather than requiring horizontal spacing. This dimensional transition resolves the contradiction by maintaining reliable wedge bonding connections while eliminating the need for additional horizontal spacing between the bonding tool and the capacitor.
2Ease of operation
If larger spacing distances are provided to accommodate aluminum wedge bond tools, then adequate clearance is ensured, but power module size increases
Solution Approach 1:
The invention relocates the capacitor to the vertical dimension, mounting it above the substrate rather than placing it in the horizontal plane. This allows the bonding tool to operate in the horizontal plane without obstruction from the capacitor, while the capacitor itself occupies vertical space. The molding compound encapsulates the substrate and extends upward to cover the capacitor leads, integrating the capacitor into the package structure without increasing the horizontal footprint of the power module.
3Ease of manufacture
If common platforms are used for multiple products with different specifications, then device cost is reduced, but platform size must accommodate the largest components
Solution Approach 1:
The vertical mounting of the capacitor allows different sized capacitors to be used across product families without requiring different platform sizes. Since all capacitors mount in the same vertical location above the substrate, the platform footprint remains constant regardless of capacitor size variations. This enables a common platform strategy where the same substrate and molding compound design can accommodate multiple product specifications by simply changing the capacitor size, thereby reducing manufacturing cost while maintaining adequate clearance for wedge bonding tools.
Data Source
AI summary
An electronic device includes a semiconductor die attached to a substrate and coupled to a circuit of the electronic device, an electronic component coupled to the circuit, and a package structure that encloses the semiconductor die, the package structure having an opening that exposes a portion of the electronic component. A method includes attaching a semiconductor die to a substrate or a die attach pad, performing an electrical connection process that couples the semiconductor die to a circuit, forming a package structure that encloses the semiconductor die and having an opening that exposes a metal terminal attached to the substrate, and attaching an electronic component through the opening to the metal terminal.