Power Module Packaging Structure with Reverse-Coupling Current Loops
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current power semiconductors are affected by parasitic inductances, leading to higher voltage spikes that negatively impact their performance and the overall reliability of power electronic devices.
Innovation Solution
A power module packaging structure is designed with a first and second conducting layer, an insulating layer, a power device, and a controlling device, where the current direction through the conducting layers forms a loop, reducing parasitic inductance by creating reverse-coupling electromagnetic fields and optimizing the thickness and area ratios of the insulating and conducting layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional power module packaging is used, then the structure is simple and easy to manufacture, but parasitic inductance is high causing voltage spikes
Solution Approach 1:
The packaging structure is segmented into multiple conducting layers (first conducting layer and second conducting layer) separated by an insulating layer. This segmentation allows the current paths to be divided and arranged in opposite directions, creating reverse-coupling electromagnetic fields that reduce parasitic inductance while maintaining manufacturability through standardized layering processes.
Solution Approach 2:
The patent transitions from a conventional single-layer planar structure to a multi-layer three-dimensional configuration. By stacking conducting layers in opposite directions with an insulating layer in between, the design utilizes the vertical dimension to create reverse-coupling electromagnetic fields, effectively reducing parasitic inductance without significantly increasing manufacturing complexity.
2Reliability
If conducting layers are placed close together to reduce inductance, then parasitic inductance decreases, but electromagnetic interference increases
Solution Approach 1:
An insulating layer is introduced as an intermediary between the first conducting layer and the second conducting layer. This insulating layer physically separates the two conducting layers, preventing direct electromagnetic coupling that would cause interference, while still allowing the reverse-coupling fields to reduce parasitic inductance. The insulating layer acts as a mediator that enables inductance reduction without compromising electromagnetic compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces voltage spikes in power semiconductors, enhancing their performance and the reliability of power electronic devices by minimizing parasitic inductance.
Implementation Method 1
a direction of a current that flows through the first conducting layer in the loop is opposite to a direction of a current that flow through the second conducting layer in the loop
Data Source
AI summary
A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.