Integrated Power Module Packaging for Lower Parasitic Impedance
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Solution Overview
Problem
Existing power electronics units face increased parasitic impedance, reduced efficiency, and increased system area due to dispersed arrangements of functional packages, which lowers assembly yield.
Innovation Solution
An intelligent power module packaging structure integrating power devices and a control chip with a gate driver and pulse width modulation controller on an insulated heat dissipation substrate, encapsulated with a lead frame, reduces device distances and enhances heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If packages providing different functions are arranged in a dispersed manner on a PCB, then each component has sufficient space for assembly, but the distances among components increase causing increased parasitic impedance and reduced system efficiency
Solution Approach 1:
The patent combines multiple functional packages (power device package, driver device package, and controller device) into a single integrated power module packaging structure. This merging reduces the distances among components, thereby reducing parasitic impedance and improving system efficiency while maintaining ease of assembly through the unified module design.
2Ease of manufacture
If packages providing different functions are arranged in a dispersed manner on a PCB, then each component can be independently assembled, but the system occupied area increases
Solution Approach 1:
The patent integrates multiple functional packages into a single power module, significantly reducing the system occupied area. The compact design places power devices, control chip, and driver circuitry in close proximity on a shared substrate, eliminating the need for separate PCB placements while maintaining independent functionality of each component.
3Adaptability or versatility
If packages providing different functions are arranged in a dispersed manner on a PCB, then assembly flexibility is maintained, but assembly yield is lowered
Solution Approach 1:
The patent consolidates multiple components into a single integrated module that can be assembled as one unit, improving assembly yield by reducing the number of separate assembly operations. The module design maintains adaptability through configurable component arrangements within the package and compatibility with standard mounting procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces parasitic impedance, enhances power electronics unit efficiency, minimizes system area, and improves assembly yield while optimizing heat dissipation.
Implementation Method 1
The encapsulant at least encapsulates the power devices, the control chip, and a portion of the lead frame
Implementation Method 2
The power devices and the control chip are disposed on the first surface of the insulated heat dissipation substrate, and the second surface of the insulated heat dissipation substrate is entirely or partially exposed outside the encapsulant. In this way, heat dissipation efficiency of the intelligent power module packaging structure may be enhanced
Data Source
AI summary
An intelligent power module packaging structure includes an insulated heat dissipation substrate, a plurality of power devices, a control chip, a lead frame, and an encapsulant. The insulated heat dissipation substrate has a first surface and a second surface opposite to the first surface. The power devices are disposed on the first surface. The control chip is disposed on the first surface. The control chip provides a gate driver function for driving the power devices and a pulse width modulation function. The lead frame is bonded onto the first surface. The power devices are electrically connected to the control chip and the lead frame. The encapsulant at least encapsulates the power devices, the control chip, and a portion of the lead frame, and the second surface is entirely or partially exposed outside the encapsulant.