Power Module Opposite-Side PCB Layout for Lower Thermal Resistance
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Solution Overview
Problem
Conventional power modules face challenges in reducing power loss and enhancing heat dissipation efficiency, particularly due to high thermal resistance and limited space for output capacitors, which affects the reliability and performance of electronic devices.
Innovation Solution
A power module design with a multi-layered structure that includes a first and second circuit board assembly, magnetic core assembly, and conductive parts, where the power module is positioned on opposite surfaces of the system board to reduce thermal resistance and increase the number of output capacitors, utilizing conductive parts for efficient heat transfer and pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power module is disposed on the same surface of the system board as the central processing unit, then the layout path is short, but the heat dissipation efficiency is poor due to high thermal resistance
Solution Approach 1:
The power module is moved from the same surface (2D layout) to the opposite surface of the system board, utilizing the third dimension (vertical arrangement) to resolve the conflict between heat dissipation efficiency and layout complexity. This spatial reconfiguration allows both the central processing unit and power module to be optimally positioned for their respective functions.
2Volume of moving object
If the output capacitors are moved to the inner space of the power module to reduce device volume, then the volume is reduced, but the power loss increases due to limited space for capacitor placement
Solution Approach 1:
Output capacitors are relocated from the traditional planar arrangement on the system board surface to the opposite surface of the system board, utilizing vertical space (third dimension) to accommodate more capacitors without increasing the device's footprint. This resolves the contradiction between minimizing volume and maintaining adequate capacitor space to reduce power loss.
3Volume of moving object
If the power module is disposed on the opposite surface of the system board to reduce device volume, then the volume is reduced, but the thermal resistance increases preventing effective heat transfer
Solution Approach 1:
A heatsink is introduced as an intermediary component between the power module on the opposite surface and the system board. The heatsink acts as a thermal mediator that efficiently conducts heat away from the power module through its extended surface area, resolving the thermal resistance issue while maintaining the volume-reduced configuration.
4Loss of energy
If more output capacitors are added to reduce power loss, then the power loss is reduced, but the device volume increases
Solution Approach 1:
Multiple output capacitors are arranged on the opposite surface of the system board, utilizing the vertical dimension to pack more capacitors into the same footprint. This allows the system to achieve lower power loss through increased capacitor capacity without proportionally increasing the device volume, as the capacitors are stacked or arranged in three-dimensional space rather than spreading out in two dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces power loss and thermal resistance, enhances heat dissipation, and allows for more output capacitors, improving the dynamic switching performance and reliability of electronic devices.
Implementation Method 1
The heat from the power module 8 can be transferred to the system board 9 through the printed circuit board 83
Implementation Method 2
The copper bars 84, 85 are magnetically coupled with the magnetic core 82 to form the output inductors of the power module 8
Data Source
AI summary
A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.