Power Module PCB Step Portions for Manufacturing Simplification
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Solution Overview
Problem
The manufacturing process of power modules is complex, leading to increased production time and design flexibility constraints, necessitating a simplification of the manufacturing process while improving performance.
Innovation Solution
A power module structure that includes a printed circuit board with step portions and a metal block mounted on these step portions, eliminating the need for guide jigs and allowing for improved thermal dissipation and current path design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional stacking and bonding process is used to manufacture power modules, then the components can be assembled, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent merges the alignment and positioning functions into the printed circuit board structure itself by forming step portions directly on the PCB during its manufacturing process. This eliminates the need for separate guide jigs and alignment tools, thereby simplifying the overall manufacturing process while reducing process complexity
Solution Approach 2:
The printed circuit board is designed to serve multiple functions: it provides electrical connections, structural support, and built-in alignment features through its step portions. This multi-functionality eliminates the need for separate alignment components, simplifying the manufacturing process
2Manufacturing precision
If guide jigs and alignment tools are used to fix component positions, then assembly accuracy is achieved, but the manufacturing process time increases
Solution Approach 1:
The alignment features (step portions) are pre-formed on the printed circuit board during its manufacturing process before the power module assembly begins. This preliminary action eliminates the need for time-consuming alignment operations during assembly, thereby maintaining positioning accuracy while reducing production time
Solution Approach 2:
The printed circuit board structure itself provides the alignment function through its step portions, eliminating the need for external guide jigs or alignment tools. The structure serves its own alignment needs, reducing manufacturing steps and time
3Adaptability or versatility
If conventional flat printed circuit board structures are used, then manufacturing is simple, but design flexibility for thermal dissipation and current paths is limited
Solution Approach 1:
The printed circuit board incorporates step portions that create localized variations in thickness and structure at specific locations. These local structural variations enable improved thermal dissipation pathways and optimized current paths without requiring complete redesign of the entire board structure, thereby enhancing design flexibility while maintaining manufacturing simplicity
Data Source
AI summary
A power module includes a first substrate formed by stacking a plurality of layers in a first axis direction, a semiconductor chip electrically connected to the first substrate, a printed circuit board connected to the semiconductor chip and comprising at least one step portion with a reduced thickness compared to the surrounding area in the first axis direction, and at least one metal block mounted on the at least one step portion in the first axis direction and electrically connected to the first substrate.