PCB-to-Ceramic Power Module Pin Assembly for Heat and Bonding
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Solution Overview
Problem
Existing power modules face challenges in achieving high strength, high heat dissipation, and excellent bonding characteristics while minimizing current path volume to improve efficiency and performance.
Innovation Solution
The power module incorporates a ceramic substrate with electrode patterns, a PCB substrate, and through holes, where a bundle type connection pin is fitted and coupled to the through holes, providing a strong and efficient electrical connection through laser welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a power module uses high voltage and high current to drive motors in electric vehicles, then the power output is improved, but heat generation increases
Solution Approach 1:
The power module employs a double-sided cooling structure where the substrate is divided into two cooling surfaces, each equipped with heat sinks. This segmentation allows heat to be dissipated from both sides of the substrate simultaneously, effectively managing the heat generated by high power operation without compromising power output.
Solution Approach 2:
Heat sinks are introduced as intermediary components that facilitate heat transfer from the substrate to the surrounding environment. The heat sinks act as mediators between the heat-generating semiconductor devices and the external environment, enabling efficient thermal management while maintaining high power output capability.
2Power
If the power module generates high heat during driving, then the power output is maintained, but bonding characteristics deteriorate
Solution Approach 1:
The substrate is segmented into two separate cooling surfaces with independent heat sink attachments. This segmentation allows for optimized thermal management at each bonding interface, preventing excessive heat accumulation that would compromise bonding characteristics while maintaining the required power output.
Solution Approach 2:
The double-sided cooling structure changes the thermal parameters of the system by providing dual heat dissipation pathways. This parameter change enables the module to maintain stable bonding characteristics under high power conditions by controlling the temperature at bonding interfaces.
3Ease of manufacture
If conventional connection methods are used for mounting substrates, then the assembly process is simple, but location accuracy of connection pins deteriorates
Solution Approach 1:
Connection pins are pre-installed into the substrate before the final assembly step. This preliminary action ensures that the connection pins are positioned with high location accuracy in advance, while the overall assembly process remains simple and convenient for subsequent steps.
4Ease of manufacture
If connection pins are mounted individually, then the assembly process is flexible, but manufacturing time increases
Solution Approach 1:
Multiple connection pins are combined into a single integrated component that is inserted into the substrate as one unit. This merging of multiple pins into a single assembly maintains the flexibility of the mounting process while dramatically reducing the time required for installation, as all pins are positioned and secured in a single operation rather than individually.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the power module's strength, heat dissipation, and bonding characteristics, reduces volume by minimizing current paths, and improves efficiency and performance, particularly for high-speed switching applications.
Implementation Method 1
bonding the connection pin to the metal layer of the ceramic substrate by laser welding
Data Source
AI summary
The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.