Transfer-Molded Power Module Pin Layout for Isolation and Low Inductance

The patent transitions signal pins from an edge arrangement (1D/2D configuration along the module perimeter) to a face arrangement (2D/3D configuration on the primary surface). This dimensional change allows signal pins to be positioned in a compact grid pattern on the module face, achieving electrical isolation through spatial separation in multiple dimensions rather than requiring increased linear spacing along the edge, thereby reducing overall module dimensions while maintaining isolation requirements.

The patent applies preliminary action by pre-forming the signal pins with appropriate bends and shapes during the molding process itself, rather than requiring post-assembly bending. The signal pins are configured with insertion-friendly geometries (such as pre-bent leads or shaped distal ends) before module assembly, allowing them to be directly inserted into PCBs without additional deformation steps that would compromise their structural integrity.

The patent extracts the protective function from external guide parts or tools and integrates it directly into the signal pin structure and molding compound. The molding compound is configured to provide mechanical support and protection to the signal pins during insertion, eliminating the need for separate guide components. This integration removes the complexity associated with additional parts while maintaining signal pin integrity.

The patent segments the leadframe structure into multiple independently formed components rather than using a single monolithic stamped piece. By dividing the current path into separate segments (such as individual power tabs, signal tabs, and interconnect elements that can be separately formed and assembled), the current flow paths are optimized to minimize loops and stray inductance, while still maintaining manufacturing simplicity through modular construction techniques.

The patent applies preliminary action by performing the substrate attachment to the thermal-dissipation appliance before completing the full package assembly. By attaching the substrate (DBC orAMB) to the heat sink or cooling jacket in an early stage, the adhesive layer can be applied and cured under controlled conditions with proper positioning and pressure, ensuring consistent thickness and minimal voids. Subsequent assembly steps (die attachment, wire bonding, molding) are then performed on the already-thermally-managed substrate, preserving adhesive quality while achieving thermal management.

The patent applies parameter changes by carefully controlling and adjusting the thermal processing parameters (temperature, time, pressure) during attachment to the thermal-dissipation appliance. The attachment process uses temperature and pressure profiles that are optimized to achieve sufficient bonding strength for the substrate-to-heat-sink interface while remaining below the re-melting temperature of the internal solder joints. This parameter optimization allows simultaneous achievement of strong bonding and solder integrity.