Power Module Sealing Structure for Moisture-Proof Pin Packaging
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Solution Overview
Problem
Conventional power modules with silicone gel packaging exhibit poor moisture-proof and waterproof performance, especially in harsh environments like servo motors and inverters.
Innovation Solution
A power module design featuring a substrate with a plastic packaging layer and a sealing layer, using a thermosetting material like EMC plastic, which includes a boss structure to enhance contact area and prevent adhesive overflow, along with a cover plate for additional protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silicone gel is used for packaging the power module components, then the packaging process is simple and flexible, but the moisture-proof and waterproof performance deteriorates
Solution Approach 1:
The patent uses a composite packaging structure combining plastic packaging layer (EMC material) with silicone gel sealing layer. The plastic layer provides moisture-proof and waterproof protection, while the silicone gel layer provides sealing and flexibility. This composite approach resolves the contradiction by achieving both ease of manufacture and reliable moisture-proof performance.
2Ease of manufacture
If adhesive is used to bond the housing, then the assembly process is simplified, but adhesive overflow occurs and affects pin exposure quality
Solution Approach 1:
The patent extracts the adhesive bonding function from the housing assembly process by using a self-aligning pin structure with positioning features. The pins have built-in positioning mechanisms that automatically align with corresponding holes in the housing, eliminating the need for adhesive and preventing overflow that would affect pin exposure quality.
Solution Approach 2:
The patent introduces a positioning mechanism as an intermediary between the pins and housing. This positioning feature acts as a mediator that ensures precise alignment during assembly, replacing the adhesive's alignment function and preventing adhesive overflow while maintaining assembly simplicity.
3Strength
If the housing is bonded first and then injection molding is performed, then the structural integrity is improved, but the waterproof performance deteriorates due to bonding seams
Solution Approach 1:
The patent performs preliminary action by pre-assembling the pins with positioning features before housing assembly. This preliminary positioning ensures that pins are correctly aligned and secured without requiring adhesive bonding, thereby eliminating bonding seams that would compromise waterproof performance while maintaining structural integrity through precise mechanical positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves waterproof and moisture-proof performance, ensuring reliable operation in adverse conditions by preventing adhesive overflow and enhancing sealing effects.
Implementation Method 1
The thermosetting material may be packaged in an injection molding manner
Implementation Method 2
When the plastic packaging layer is used to seal the components, the plastic packaging layer is prepared by a thermosetting material
Data Source
AI summary
A power module is provided. The power module includes a substrate, and the substrate is used to carry components and pins of the power module. A circuit layer is disposed on the substrate, to complete an electrical connection between the carried components. The components and the pins are disposed on a same surface of the substrate, and the components and the pins are electrically connected by using the substrate. The power module further includes a sealing layer. The sealing layer is sleeved on the pins, the pins are partially exposed on a surface that is of the sealing layer and that faces away from a plastic packaging layer, and a space for accommodating the plastic packaging layer is formed between the sealing layer and the substrate.