Power Module Pin Segmentation for Footprint Reduction
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Solution Overview
Problem
Conventional power modules face challenges in reducing size and increasing power density due to large footprint wave-shaped pins and thin metal layers, which affect conduction performance and manufacturing costs.
Innovation Solution
A manufacturing method for a power module that includes a substrate with conductive wires, leading components with horizontal and vertical portions, and a molding layer, where the leading components are pre-connected in a unit and separated to form independent components, optimizing the pin assembly and reducing the module's footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If wave-shaped pins are used to ensure large current-carrying capacity, then current-carrying capacity is improved, but footprint area increases
Solution Approach 1:
The pin structure is segmented into a straight portion and a bent portion, where the straight portion provides current carrying function and the bent portion provides mechanical anchoring function. This segmentation allows the pin to achieve both large current-carrying capacity and reduced footprint area by optimizing the spatial arrangement of different functional segments.
2Ease of manufacture
If wave-shaped pins with height less than twice the length or width are used to ensure manufacturing convenience, then ease of manufacture is improved, but power density decreases
Solution Approach 1:
The pin is divided into a straight portion and a bent portion, allowing the straight portion to be optimized for current carrying (reducing footprint) and the bent portion to provide sufficient height for mechanical anchoring. This segmentation enables manufacturing convenience while achieving high power density through reduced footprint area.
3Ease of manufacture
If Cu metallization process is used to create thin metal layers for terminals, then ease of manufacture is improved, but conduction losses increase
Solution Approach 1:
The invention changes the parameter of metal layer thickness by using a thick metal layer (greater than 10 micrometers) instead of the conventional thin metallization layer. This parameter change reduces conduction losses while still maintaining ease of manufacture through standard PCB fabrication processes capable of producing thick copper layers.
4Loss of energy
If thick metal layers are used to reduce conduction losses, then conduction performance is improved, but manufacturing cost increases
Solution Approach 1:
The invention uses thick metal layers (greater than 10 micrometers) to reduce conduction losses, and this is achieved through standard PCB fabrication processes that can produce thick copper layers. The thick metal layer is integrated into the substrate structure rather than being added as a separate component, which avoids additional manufacturing steps and keeps costs competitive.
Data Source
AI summary
A power module and a manufacturing method thereof are disclosed. The power module includes a substrate, a power device, a leading component and a molding component. The substrate includes a first side, a second side and a conductive wire. The power device is disposed on the substrate and electrically connected with the conductive wire. The leading component is disposed on the substrate and includes a first horizontal portion and a vertical portion connected with each other. The vertical portion is electrically connected with the conductive wire. The leading component includes a first contact surface and a second contact surface, which are non-coplanar. The molding component is disposed on the substrate and covers at least portion of the substrate and at least portion of the leading component. The first contact surface and the second contact surface are uncovered by the molding component.