Power Module Pin Separation for Creepage Distance Compliance
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Solution Overview
Problem
Existing power modules face challenges in reducing their size while complying with safety regulations due to the limited distance between adjacent pins.
Innovation Solution
The power module design incorporates a substrate with a semiconductor component and a package body that includes a plurality of pins and separating elements. These separating elements, which can be protruding or concave structures, are placed between adjacent pins to increase the creepage distance, allowing for a shorter pin distance and thus a smaller module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between adjacent pins is reduced to decrease module size, then the volume of the power module is reduced, but the compliance with safety regulations deteriorates
Solution Approach 1:
A separating element is introduced as an intermediary component between adjacent pins. This separating element increases the creepage distance between pins while allowing the pins to be positioned closer together, thus reducing the overall module volume while maintaining safety regulation compliance.
Solution Approach 2:
The separating element extends in the vertical dimension (along the second axis perpendicular to the pin arrangement axis), creating additional insulation path length without increasing the horizontal footprint. This dimensional approach allows reduced pin spacing while maintaining required creepage distances.
2Reliability
If separating elements are added between adjacent pins to increase creepage distance, then safety regulation compliance is improved, but the device complexity increases
Solution Approach 1:
The separating element serves multiple functions simultaneously: it increases the creepage distance between adjacent pins for safety compliance, and it can be made of elastic materials to provide impact buffering protection. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The separating element's material properties are optimized by using elastic materials that provide both the required electrical insulation for creepage distance and mechanical flexibility for impact absorption, changing the material parameter to achieve multiple protective functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the power module to meet safety regulations while reducing its overall size, and the elastic separating elements provide additional protection against impact damage.
Implementation Method 1
The first separating elements, the second separating elements and the third separating elements are made of elastic materials
Implementation Method 2
The package body is configured to cover the first metal surface and the semiconductor component, and the package body partially encloses each of the pins
Implementation Method 3
the substrate further has a second metal surface configured to dissipate heat generated by the power module to the external environment
Data Source
AI summary
A power module is provided. The power module includes a substrate, a semiconductor component, a plurality of pins and a package. The substrate has a first metal surface. The semiconductor component is disposed on the first metal surface. The plurality of pins extends from the first metal surface and is configured to be electrically connected to the semiconductor component. The package body is configured to cover the first metal surface and the semiconductor component, and the package body partially encloses each of the pins. There is a gap between each two adjacent pins, and a separating element is disposed in each gap to increase a creepage distance between the two adjacent pins.