Power Module Cover Plate for Pin Position Stability

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Solution Overview

Problem

During the encapsulation of power modules, the plastic packaging material used in injection molding often causes pins to become skewed, leading to positioning issues and reduced adaptation between the power module and the system end, affecting the product yield and reliability of connections.

Innovation Solution

A cover plate with a plate body and gasket design, featuring holes for interference fit with pins, which includes a limiting part to enhance position precision and reliability, using materials like polyphenylene sulfide and vulcanized silicone for structural support and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If plastic packaging material is pressed by mold during injection molding, then encapsulation protection is achieved, but the pin becomes skewed and position precision deteriorates

Engineering Contradiction:
Improveencapsulation protectionVSAvoidpin position precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The cover plate is designed with pre-formed holes that correspond to pin positions before the injection molding process. This preliminary structure prevents the pins from becoming skewed during encapsulation, as the holes guide and constrain the pins in their correct positions throughout the molding process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The cover plate acts as an intermediary component between the pins and the mold. It provides a stable framework with precisely positioned holes that protect the pins from direct contact with the pressing mold, thereby maintaining pin position precision while still allowing the mold to apply pressure for encapsulation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If no limiting structure is provided for pins, then device complexity is reduced, but pin position stability deteriorates

Engineering Contradiction:
Improvestructure complexityVSAvoidpin position stability
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The cover plate is segmented with multiple discrete holes, each corresponding to a specific pin position. This segmentation allows each pin to be independently positioned and stabilized without requiring a complex continuous limiting structure, thus maintaining simplicity while ensuring position stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cover plate provides localized support at specific pin positions through precisely positioned holes, rather than requiring a complex overall structure. Each hole is strategically placed to match pin locations, providing stability exactly where needed while keeping the rest of the structure simple and lightweight.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240162100A1Cover plate, power module, and electronic device
Publication Date: 2024.05.16 HUAWEI DIGITAL POWER TECH CO LTD
  • US20240162100A1 patent drawing
  • US20240162100A1 patent drawing
  • US20240162100A1 patent drawing

AI summary

A cover plate may include a plate body and a gasket. The plate body includes a first face and a second face that are disposed back from each other, and the plate body is provided with a first hole. The gasket includes a body part, and the body part is provided with a second hole, and in a direction from the first face to the second face, the first hole penetrates through the plate body, and the second hole penetrates through the body part. When the cover plate is applied to the power module, each pin of the power module may pass through one second hole and be inserted into one first hole in a one-to-one correspondence, and the pin is in interference fit with the corresponding first hole. In this way, the plate body may limit each pin, thereby improving a position degree of the pin.