Power Packaging Module With Plated Inductor Interconnect

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Solution Overview

Problem

IC packaging power supply modules face soldering reliability issues and impedance problems due to the limited size of metal connecting structures, which prevents them from overlapping with inductor terminal bond pads, affecting thermal conduction and electrical connectivity.

Innovation Solution

A packaging module is designed with a metal plating layer between the metal connecting structures and the terminal bond pads of the magnetic component, ensuring electrical connection and increasing the reliability of soldering, while also reducing impedance and thermal resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the metal connecting structure size is limited by the layout dimensions of the bare die, then the packaging module maintains compact size, but soldering reliability deteriorates and impedance increases

Engineering Contradiction:

Improvepackaging module sizeVSAvoidsoldering reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent extends the metal connecting structure from the bare die layout plane into the vertical dimension by adding a metal plating layer that overlaps with the inductor terminal bond pad in the vertical projection. This dimensional transition allows the connecting structure to achieve both compact footprint and enhanced soldering area without increasing the horizontal layout dimensions.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The metal plating layer acts as an intermediary between the metal connecting structure and the inductor terminal bond pad. It provides an extended bonding surface that improves soldering reliability while maintaining the compact packaging module size, effectively mediating between the conflicting requirements of small size and high reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If the metal connecting structure size is limited by the layout dimensions of the bare die, then the packaging module maintains compact size, but thermal conduction performance deteriorates

Engineering Contradiction:

Improvepackaging module sizeVSAvoidthermal conduction

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The metal plating layer extends the thermal conduction path from the inductor terminal bond pad into the vertical dimension, providing additional thermal pathways that improve heat dissipation performance without increasing the horizontal footprint of the packaging module.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If the metal connecting structure size is increased to improve soldering reliability, then soldering reliability improves, but the layout dimensions of the bare die are exceeded

Engineering Contradiction:

Improvesoldering reliabilityVSAvoidbare die layout area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

Instead of increasing the horizontal area of the metal connecting structure, the patent utilizes the vertical dimension by adding a metal plating layer that overlaps with the inductor terminal bond pad. This allows the connecting structure to achieve larger effective bonding area without exceeding the bare die layout dimensions.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of the metal plating layer enhances the reliability of soldering and reduces current flow impedance and thermal resistance from the inductor to the module output ground, thereby improving the overall performance of the packaging module.

Implementation Method 1

The metal plating layer is in contact with the metal connecting structures and the terminal bond pads, respectively, to form an electrical connection with each

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

reduces thermal resistance from the inductor to the module output ground

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250157903A1Packaging module and manufacturing method therefor

Publication Date: 2025.05.15 SILERGY SEMICON TECH (HANGZHOU) CO LTD

AI summary

A packaging module and a manufacturing method therefor are provided. The packaging module includes a first packaging structure and a magnetic component. The first packaging structure includes a plastic packaging structure for encapsulating a non-magnetic component and metal connecting structures and exposing top surfaces of the metal connecting structures. The magnetic component is disposed above the first packaging structure includes terminal bond pads and a metal plating layer disposed between the metal connecting structures and the terminal bond pads. Vertical projections of the metal connecting structures and the terminal bond pads partially overlap on the horizontal plane. The metal plating layer contacts with the metal connecting structures and the terminal bond pads to form an electrical connection. The packaging module can enhance the reliability of soldering, further reduce the current impedance of the inductance, and decrease the thermal resistance from the inductance to the module output ground.