Power Module Assembly With Pre-Packaging Semiconductor Testing
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Solution Overview
Problem
Existing power module manufacturing processes do not effectively detect defects in semiconductor devices until the power module is completed, leading to unnecessary material consumption and process losses.
Innovation Solution
A manufacturing method that involves bonding a semiconductor device to a lower substrate, disposing an upper bonding member on the semiconductor device, contacting a probe device with the upper bonding member, and electrically connecting it to a tester to test the semiconductor device's electrical characteristics before completing the power module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical characteristics inspection is performed on finished power modules, then complete packaging and assembly can be achieved, but defects in semiconductor devices cannot be detected in advance leading to material waste and process loss
Solution Approach 1:
The patent applies preliminary action by performing electrical characteristics inspection on semiconductor devices at an intermediate stage before complete packaging. The semiconductor device is bonded to a lower substrate, an upper bonding member is disposed on the semiconductor device, and a probe device contacts the upper bonding member for testing. This early detection approach identifies defects before final assembly, preventing material waste from processing defective devices through subsequent packaging steps.
2Reliability
If electrical characteristics inspection is performed on finished power modules, then complete packaging and assembly can be achieved, but significant process loss occurs due to unnecessary processing of defective devices
Solution Approach 1:
The patent performs electrical characteristics inspection at an intermediate manufacturing stage, before final packaging and assembly operations. By testing the semiconductor device after bonding to the lower substrate but before complete module assembly, the process detects defects early and prevents unnecessary consumption of subsequent processing time on defective devices.
3Reliability
If a probe device contacts the upper bonding member for testing, then electrical characteristics can be measured early, but additional components and process steps are required
Solution Approach 1:
The patent introduces an upper bonding member as an intermediary component that facilitates early electrical testing. This bonding member is disposed on the semiconductor device and serves as a contact point for the probe device, enabling electrical characteristics inspection before final packaging. The intermediary bonding member allows test probe access without requiring complete module assembly, resolving the conflict between early detection and process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the detection of defects in semiconductor devices at an intermediate stage, reducing material waste and process losses, and enabling early identification of defects without damaging the semiconductor device.
Implementation Method 1
the lower bonding member and the upper bonding member may include a material having electrical conductivity
Data Source
AI summary
A manufacturing method of a power module includes operations of bonding a semiconductor device to a lower substrate, disposing an upper bonding member on an upper portion of the semiconductor device; contacting a probe device with the upper bonding member, electrically connecting the probe device to a tester and testing electrical characteristics of the semiconductor device, and bonding an upper substrate to the semiconductor device through the upper bonding member.