Power Semiconductor Module Press-Fit Contacts for Faster Assembly
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Solution Overview
Problem
Existing methods for coupling power semiconductor modules to external appliances, such as soldering, sintering, or gluing, are time-consuming and can result in variable joint quality, necessitating an alternative that simplifies the coupling process and reduces fabrication costs.
Innovation Solution
A power semiconductor module design featuring a first and second substrate with a power semiconductor die between them, coupled to a rivet or press fit pin on one side, encapsulated by an encapsulant, with exposed ends to form external contacts, allowing for efficient electrical connection without additional soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional coupling methods (soldering, sintering, or gluing) are used to connect power semiconductor modules to external appliances, then reliable electrical contact can be achieved, but the fabrication time increases and costs increase
Solution Approach 1:
The patent extracts the coupling function from the traditional soldering/sintering/gluing process and integrates it directly into the module structure through rivets or press-fit pins that are embedded in the substrate during manufacturing. This eliminates the need for separate post-assembly coupling operations, thereby reducing fabrication time while maintaining reliable electrical contact.
Solution Approach 2:
The rivets or press-fit pins are prepared and positioned on the substrate before the power semiconductor components are assembled. This preliminary action allows the coupling elements to be pre-aligned and pre-positioned, enabling faster final assembly without compromising joint quality, thus reducing overall fabrication time.
2Reliability
If traditional coupling methods (soldering, sintering, or gluing) are used to connect power semiconductor modules to external appliances, then reliable electrical contact can be achieved, but the fabrication costs increase
Solution Approach 1:
The patent extracts the coupling function from expensive traditional processes and replaces it with simpler, more cost-effective rivet or press-fit pin connections that can be manufactured using standard assembly techniques, thereby reducing fabrication costs while maintaining adequate joint quality.
Solution Approach 2:
The patent employs rivets or press-fit pins that are simpler and less expensive than soldering materials or sintering equipment requirements. These coupling elements can be manufactured and installed using basic tooling, significantly reducing fabrication costs compared to traditional methods while providing sufficient reliability for the application.
3Productivity
If rivets or press fit pins are used to simplify the coupling process, then fabrication time and costs are reduced, but additional steps are required to ensure proper exposure and electrical contact
Solution Approach 1:
The patent merges the coupling elements (rivets or press-fit pins) with the substrate structure itself, making them integral parts of the module housing. This integration allows the coupling function to be achieved without adding separate components or complex assembly steps, thereby increasing productivity without significantly increasing device complexity.
Solution Approach 2:
The rivets or press-fit pins serve multiple functions: they provide mechanical attachment, establish electrical contact, and enable external coupling. This multi-functionality reduces the need for separate components and simplifies the overall module structure, allowing faster assembly without compromising functionality.
Data Source
AI summary
A power semiconductor module includes: first and second substrates; at least one power semiconductor die arranged between and thermally coupled to a first side of each substrate, and electrically coupled to the first side of the first substrate; at least one rivet having a first end arranged on and electrically coupled to the first side of the first substrate; and an encapsulant encapsulating the at least one power semiconductor die, the at least one rivet and the substrates. At least parts of a second side of the substrates are exposed from the encapsulant. A second end of the at least one rivet is exposed at the encapsulant and configured to accept a press fit pin such that the at least one power semiconductor die can be electrically contacted from the outside.