Radial Arm Circuit Layout in Power Modules to Reduce Inductance

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Solution Overview

Problem

Existing power modules have high inductance, which hinders efficient power conversion and energy consumption.

Innovation Solution

A power module design with arm circuits overlapping a circle around the input terminal, featuring a wiring pattern and switching elements connected in series, reduces inductance by leveling current flow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional power module layout is used, then ease of manufacture is maintained, but inductance is high which reduces power conversion efficiency

Engineering Contradiction:
Improvepower conversion efficiencyVSAvoidlayout complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies asymmetry by positioning arm circuits at non-uniform angular intervals around the first input terminal. Specifically, the arm circuits are arranged at angles of 0°, 120°, and 240°, creating an asymmetric layout that optimizes current distribution and reduces inductance. This asymmetric arrangement allows for better current path balancing while maintaining manufacturing feasibility through standardized mounting procedures.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent transitions from a conventional linear or planar circuit layout to a radial three-dimensional arrangement. By positioning arm circuits at different angular positions around a central input terminal and connecting them through a common neutral point, the design utilizes spatial dimensionality to optimize electrical characteristics. This radial configuration reduces current path lengths and minimizes loop areas, thereby reducing inductance while maintaining ease of manufacture through modular circuit board design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If arm circuits are arranged radially around the input terminal, then inductance is reduced, but manufacturing complexity increases

Engineering Contradiction:
ImproveinductanceVSAvoidassembly difficulty
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The patent segments the power module into independent arm circuit units, each comprising switching elements and associated components. These modular arm circuits can be manufactured and tested separately before final assembly around the input terminal. This segmentation enables standardized production processes while achieving the low-inductance radial configuration, as each module can be assembled using conventional techniques and then integrated into the final radial arrangement.

Inventive Principle:
Principle #1Segmentation

3Device complexity

If conventional linear wiring pattern is used, then ease of manufacture is maintained, but current flow is not leveled which increases inductance

Engineering Contradiction:
Improvewiring pattern complexityVSAvoidcurrent distribution uniformity
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent implements equipotentiality by connecting all arm circuits to a common neutral point, ensuring that each arm circuit operates at the same reference potential. This equalizes the electrical conditions for current flow through each arm, promoting uniform current distribution. The common neutral point acts as an equipotential reference that balances the electrical stresses and current paths, improving reliability while the wiring pattern remains manageable through systematic routing.

Inventive Principle:
Principle #12Equipotentiality

Data Source

PatentUS12464640B2Power module
Publication Date: 2025.11.04 ROHM CO LTD
  • US12464640B2 patent drawing
  • US12464640B2 patent drawing
  • US12464640B2 patent drawing

AI summary

A power module includes a insulation substrate, a first and a second input terminal supported by the insulation substrate, a plurality of arm circuits provided on the insulation substrate, and a plurality of output terminals corresponding to the plurality of arm circuits. The arm circuits each include a part of a wiring pattern formed on the insulation substrate, and a first switching element and a second switching element mutually connected in series via the part of the wiring pattern. The output terminals are each connected to a connection point between the first switching element and the second switching element in a corresponding one of the plurality of arm circuits. The plurality of arm circuits are located so as to overlap with a circle surrounding the first input terminal, as viewed in a thickness direction the insulation substrate.