Power Module Radiator Portion for Heat Dissipation
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Solution Overview
Problem
Conventional electrical power converters for electric vehicles face increased production costs due to the need for highly heat-resistant discharge resistors, which generate heat and deteriorate smoothing capacitors, leading to inefficiencies and higher costs.
Innovation Solution
A power module with a radiator portion for heat dissipation, allowing the use of lower heat-resistant materials for discharge resistors, integrated with semiconductor switches and lead frames, reducing thermal impact on capacitors and eliminating the need for additional attachment components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a highly heat-resistant discharge resistance is used, then the discharge resistance can withstand the heat generated during operation, but the production cost increases
Solution Approach 1:
The discharge resistance is extracted from the capacitor housing and integrated into the power module's lead frame structure. By separating the discharge resistance function from the capacitor assembly, the capacitor can use standard materials while the discharge resistance is provided by the heat-dissipating lead frame structure, reducing overall production costs
Solution Approach 2:
The lead frame is designed to serve multiple functions: electrical connection, structural support, and heat dissipation. The lead frame's high thermal conductivity and large surface area enable it to function as both an electrical conductor and a heat sink, eliminating the need for separate heat-resistant materials for the discharge resistance
2Reliability
If the discharge resistance is placed near the smoothing capacitor, then the discharge function is effective, but the heat from the discharge resistance deteriorates the smoothing capacitor properties
Solution Approach 1:
The heat generated by the discharge resistance is converted into a beneficial cooling effect for the capacitor. The lead frame's thermal conductivity, which would normally conduct heat to the discharge resistance, instead conducts heat away from the capacitor, using the discharge resistance's thermal path to cool the capacitor rather than heat it
Solution Approach 2:
The lead frame acts as an intermediary between the capacitor and the discharge resistance. It provides a thermal pathway that directs heat away from the capacitor while enabling the discharge resistance to function, mediating the thermal interaction between these two components to prevent harmful heat transfer
3Object-affected harmful factors
If additional attachment components are used to protect the capacitor from heat, then the capacitor is protected, but the device complexity and assembly process are increased
Solution Approach 1:
The discharge resistance and heat dissipation functions are merged into the lead frame structure itself. The lead frame's inherent thermal properties and geometric design provide both electrical connectivity and thermal management, eliminating the need for separate protective components and simplifying the overall device structure
Solution Approach 2:
The lead frame is designed as a multi-functional component that simultaneously provides electrical connection, structural support, and heat dissipation. This universal design eliminates the need for multiple specialized components, reducing device complexity and assembly requirements while maintaining effective heat protection for the capacitor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces production costs by using lower heat-resistant materials for discharge resistors while maintaining efficient heat dissipation, preventing capacitor heating and simplifying assembly processes.
Implementation Method 1
a radiator portion for radiating heat from the first lead frame and/or the second lead frame is formed in at least a part of the package
Implementation Method 2
The lead frames are typically elongated metal plates... transferring heat from the first semiconductor switch and/or the second semiconductor switch
Data Source
AI summary
In order to prevent an increase in temperature of a discharge resistance discharging an electric charge accumulated in a smoothing capacitor, the present description discloses a power module. The power module has a first lead frame, a second lead frame, first and second semiconductor switches connected in series between the first lead frame and the second lead frame, a resistor connected between the first lead frame and the second lead frame, and a resin package that encapsulates the first lead frame, the second lead frame, the first semiconductor switch, the second semiconductor switch, and the resistor. In this power module, a radiator portion for radiating heat from the first lead frame and/or the second lead frame is formed in at least a part of the package.