Power Module Alignment Structure for Bend-Free Terminal Insertion
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Solution Overview
Problem
Existing power modules face challenges in precise mechanical and electrical connection to assembly boards, with terminals often misaligned or bent during insertion into contact holes, necessitating improved alignment and support mechanisms.
Innovation Solution
The integration of an alignment part with recessed portions and holding structures on the semiconductor module component provides precise lateral alignment and vertical support for terminals, ensuring they fit correctly into contact holes on the assembly board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If terminals are directly inserted into contact holes without alignment support, then the connection process is simpler, but the terminals become misaligned or bent during insertion
Solution Approach 1:
The alignment part serves as an intermediary component between the semiconductor module component and the assembly board. It includes recessed portions that receive and laterally align terminals, and holding structures that provide vertical support during insertion. This mediator structure prevents direct contact between terminals and the assembly board, eliminating misalignment and bending issues while maintaining a relatively simple overall structure.
2Measurement precision
If an alignment part is integrated to provide precise alignment and support, then terminal positioning accuracy improves, but the device structure becomes more complex
Solution Approach 1:
The alignment part is merged with the semiconductor module component through fixation, creating an integrated alignment structure. The recessed portions and holding structures are combined into a single component that performs multiple functions: lateral alignment of terminals, vertical support during insertion, and structural integration with the module. This merging reduces the number of separate parts while achieving precise positioning.
Solution Approach 2:
The alignment part performs multiple functions simultaneously: it provides lateral alignment through recessed portions, vertical support through holding structures, and structural integration with the semiconductor module component. This multi-functionality achieves precise terminal positioning without requiring multiple separate components, thereby reducing overall device complexity.
3Reliability
If terminals are supported during insertion, then insertion safety improves, but the structural complexity increases
Solution Approach 1:
The holding structures of the alignment part serve as intermediary support elements during terminal insertion. These structures provide vertical support to terminals, distributing insertion forces and preventing sudden impacts or misalignments. The support is integrated into the alignment part rather than requiring separate cushioning or support components, maintaining structural simplicity while improving insertion safety.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3~4A
AI summary
A power module (100) comprising a semiconductor module component (10) and an alignment part (20) is provided, wherein the alignment part (20) is fixed on a lateral top surface (10T) of the semiconductor module component (10) and comprises at least one recessed portion (20R). The semiconductor module component (10) comprises at least one terminal (12, 13) which - at least in places - is orientated vertically with respect to the lateral top surface (10T) of the semiconductor module component (10) and for the purpose of alignment along lateral directions, is located at least partly within the at least one recessed portion (20R). Along a vertical direction, the at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R). Moreover, a method for forming the power module (100) comprising a semiconductor module component (10) is provided.