Power Module Relay Substrate Copper Block Current Flow
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Solution Overview
Problem
The existing power modules with a single-layer relay substrate structure face variations in current flow due to differences in contact resistance between semiconductor devices and conductive posts, leading to insufficient current-carrying capability.
Innovation Solution
A power module configuration featuring a relay substrate with a first and second conductor layer, copper blocks connecting these layers, semiconductor devices with a main electrode facing the copper blocks, and an insulating substrate sealed with a sealer, where each semiconductor device is connected through a single copper block, eliminating variations in current flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer relay substrate structure is used, then the device complexity is reduced, but current variations occur due to contact resistance differences between semiconductor devices and conductive posts
Solution Approach 1:
The relay substrate is divided into multiple conductor layers (first conductor layer and second conductor layer) separated by an insulating layer. This segmentation isolates the conductive paths, preventing current variations caused by contact resistance differences while maintaining structural simplicity.
2Power
If multiple copper blocks are used to connect semiconductor devices, then the current-carrying capability is improved, but intervals between copper blocks are required which increases the module size
Solution Approach 1:
The conductor layers are stacked in the thickness direction (vertical dimension) rather than arranging copper blocks horizontally. This dimensional transition allows multiple conductive paths to be stacked vertically, eliminating the need for horizontal intervals between copper blocks and reducing the overall module footprint.
3Reliability
If copper blocks are connected to through-holes in the relay substrate, then the electrical connection is improved, but variations in contact resistance cause current magnitude variations
Solution Approach 1:
An insulating layer is introduced as an intermediary between the first and second conductor layers. This insulating layer with through-holes provides a controlled pathway for electrical connection, eliminating the direct contact resistance issues between copper blocks and the substrate while maintaining reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents current variations and allows for miniaturization by eliminating the need for intervals between copper blocks, enhancing heat capacity and radiation performance.
Implementation Method 1
copper blocks provided in holes penetrating through the relay substrate in a thickness direction and connecting the first conductor layer to the second conductor layer
Implementation Method 2
an insulating substrate connected to back-surfaces of the semiconductor devices via joining materials
Implementation Method 3
a sealer sealing the relay substrate, the copper blocks, and the semiconductor devices
Data Source
AI summary
A power module includes: a relay substrate including a first conductor layer provided on a front surface and a second conductor layer provided on a back surface; copper blocks provided in holes penetrating through the relay substrate in a thickness direction and connecting the first conductor layer to the second conductor layer; semiconductor devices wherein each semiconductor device includes a main electrode provided at a location facing an end face of the corresponding copper block and only one copper block is electrically connected to one main electrode; an insulating substrate connected to back-surfaces of the semiconductor devices via joining materials; and a sealer sealing the relay substrate, the copper blocks, and the semiconductor devices.