Power Module Assembly Resilient Clamping Heat Dissipation

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Solution Overview

Problem

Conventional on-board power supply assemblies face challenges in heat dissipation, power density, and efficient assembly methods, leading to increased labor and cost, as well as potential damage to power devices due to direct screw attachment and clamping methods.

Innovation Solution

A power module assembly utilizing a resilient set with symmetrical bird-wing shaped pieces disposed between the circuit board and housing to clamp and push power devices against a heat-dissipation surface, enhancing heat dissipation and power density while simplifying assembly procedures and reducing labor and production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If screws directly pass through power devices into heat-dissipating housing, then power devices are firmly attached, but assembly requires large quantity of manpower and damages power devices easily

Engineering Contradiction:
Improveattachment firmnessVSAvoidassembly efficiency
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent introduces a resilient steel sheet as an intermediary component between the power devices and heat-dissipating housing. This resilient sheet acts as a mediator that distributes the clamping force uniformly across multiple power devices, eliminating the need for direct screw attachment to each device while achieving firm attachment through the resilient sheet's elastic deformation and continuous contact pressure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If resilient steel sheet directly clamps power devices to heat-dissipating housing, then assembly is simplified, but power density cannot be effectively raised

Engineering Contradiction:
Improveassembly simplicityVSAvoidpower density
Core Design Contradiction:
Ease of manufactureVSPower

Solution Approach 1:

The patent transitions from planar arrangement of power devices to a three-dimensional stacked configuration. Multiple power devices are arranged in vertical layers within the housing, utilizing the height dimension to increase power density. The resilient steel sheet is designed with corresponding multi-layer clamping structures that can simultaneously secure devices across multiple levels, enabling compact vertical stacking while maintaining assembly simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Power

If power devices are intensively placed together, then power density increases, but heat dissipation becomes more difficult

Engineering Contradiction:
Improvepower densityVSAvoidheat dissipation
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent implements localized heat dissipation structures directly at each power device location. Each power device is equipped with its own heat-dissipating components (such as heat sinks or thermal vias) that are spatially distributed throughout the housing. This local quality approach ensures that heat is dissipated at its source, preventing heat accumulation even when devices are intensively placed together, while the resilient steel sheet maintains uniform contact pressure to ensure effective thermal coupling.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively enhances heat dissipation and power density, simplifies assembly, reduces labor and costs, and improves the reliability of the assembly structure by using a resilient set to securely fasten and dissipate heat from power devices.

Implementation Method 1

a resilient piece (31) including a base section (32) and two pushing fingers (33) outwardly extended from two opposite edges of the base section (32) respectively

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentEP3448138B1Power module assembly and assembling method thereof
Publication Date: 2022.05.11 DELTA ELECTRONICS (SHANGHAI) CO LTD
  • EP3448138B1 patent drawingFigure 1
  • EP3448138B1 patent drawingFigure 2
  • EP3448138B1 patent drawingFigure 3

AI summary

The present disclosure provides a power module assembly and an assembling method thereof. The power module assembly (1, 1a) includes a housing (10), a circuit board (20), at least one resilient set (30, 30a), at least two power devices (40), and at least one fastening unit (50). The housing (10) includes at least one heat-dissipation surface (11). The at least one resilient set (30, 30a) is disposed between the housing (10) and the circuit board (20) and includes at least one resilient piece (31). Each resilient piece (31) includes a base section (32) and two pushing fingers (33), so as to form an M-word shape or a bird-wings shape. The fastening unit (50) is disposed between the two power devices (40), connected to the base section (32) of the resilient piece (31) and configured to drive the base section (32) of the resilient piece (31), so that the two pushing fingers (33) of the resilient piece (31) push against the two power devices (40) respectively and the two power devices (40) are attached to the heat-dissipation surface (11).