Power Module Insulating Member Structure to Prevent Resin Burrs
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Solution Overview
Problem
Conventional semiconductor devices with insulating members made of inflexible materials hinder effective heat dissipation due to thermal resistance issues and resin burrs that compromise adhesion and insulation properties when using thermal compounds, and existing flexible insulating members can lead to resin burrs during molding.
Innovation Solution
A semiconductor device design featuring a flexible insulating member with a convex portion protruding from a recessed area on the sealing member's lower surface, preventing resin burrs and enhancing adhesion by eliminating the need for thermal compounds and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a flexible insulating member is provided on the heat dissipation surface of the power module, then heat dissipation efficiency is improved and thermal compound is eliminated, but resin burrs are likely to occur during molding which deteriorate adhesion and insulation properties
Solution Approach 1:
The flexible insulating member is divided into multiple layers: a base layer bonded to the heat dissipation surface and a protruding layer extending toward the mold cavity. This segmentation allows the base layer to maintain thermal contact while the protruding layer prevents resin burr formation, resolving the contradiction between heat dissipation efficiency and reliability.
Solution Approach 2:
Different portions of the flexible insulating member have different functions: the base layer provides thermal conduction and electrical insulation, while the protruding layer specifically prevents resin burr entry. This local differentiation of quality and function allows simultaneous achievement of heat dissipation efficiency and reliability.
2Strength
If thermal compound is applied to fill gaps between the cooler and the insulating member, then adhesion is improved, but thermal resistance increases which inhibits cooling effect
Solution Approach 1:
The invention extracts and eliminates the thermal compound from the system by providing a flexible insulating member with protruding portions that directly fill and prevent gaps between the cooler and insulating member. This removes the harmful thermal resistance of thermal compound while maintaining adhesion through direct contact.
Solution Approach 2:
The flexible insulating member is designed to be self-adhering to the cooler surface through its protruding portions that conform to surface irregularities, eliminating the need for thermal compound adhesion while maintaining thermal contact. The member serves its own adhesion function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reduces assembly costs, and improves the quality and safety of semiconductor devices by preventing resin burrs and maintaining insulation integrity.
Implementation Method 1
the flexible insulating member is bonded to a lower surface of the die bonding portion... enhancing heat dissipation
Data Source
AI summary
In a semiconductor device including a flexible insulating member on a heat dissipation surface, resin burrs entering underneath the flexible insulating member are prevented from generating in a sealing member. A power module includes a conductive die bonding portion, a semiconductor element bonded to an upper surface of the die bonding portion, a sealing member sealing the die bonding portion and the semiconductor element, and a flexible insulating member bonded to a lower surface of the die bonding portion. The flexible insulating member is arranged in a recessed portion on a lower surface of the sealing member and has a convex portion protruding from the lower surface of the sealing member.