Power Module Resin Structure for Dual-Sided Cooling and Warpage Control
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Solution Overview
Problem
Existing power conversion devices face challenges in improving cooling performance and manufacturability due to one-sided cooling and warpage issues in power modules, particularly in high-temperature environments.
Innovation Solution
A power conversion device design that includes a molding resin covering and sealing power modules and circuit boards, with thinner seal surface portions and flow path forming bodies for dual-sided cooling, reducing warpage and enhancing manufacturability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If one-sided cooling structure is used, then the structure is simple, but the cooling performance is low
Solution Approach 1:
The patent transitions from one-sided cooling to double-sided cooling by adding cooling functionality in another dimension (the opposite side of the power module). The molding resin is configured with different thicknesses on opposite sides, enabling heat dissipation paths on both sides of the power module, thereby improving cooling performance without proportionally increasing structural complexity.
2Manufacturing precision
If uniform thickness molding resin is used, then the manufacturing is simple, but warpage occurs during resin hardening
Solution Approach 1:
The patent applies local quality by configuring the molding resin with different thicknesses in different regions. Specifically, the resin thickness is greater on the side without seal surface portions compared to regions with seal surface portions. This non-uniform thickness distribution compensates for differential cooling rates and shrinkage during hardening, effectively suppressing warpage while maintaining manufacturability.
3Reliability
If thicker seal surface portions are used, then the sealing is more reliable, but the cooling performance is reduced
Solution Approach 1:
The patent applies local quality by creating distinct regions in the molding resin: thinner seal surface portions for reliable sealing and thicker cooling regions for efficient heat dissipation. The seal surface portions are localized at specific areas where sealing is required, while other regions maintain greater thickness to facilitate heat transfer to the cooling structure, thus balancing sealing reliability with cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves cooling performance by cooling both sides of the power modules, suppresses warpage during resin hardening, and enhances manufacturability by simplifying the assembly process and reducing inductance.
Implementation Method 1
the seal surface portions are thinner than regions sealing the plurality of power modules
Implementation Method 2
there is a problem that the cooling performance is low as compared with that in double-sided cooling in which both upper and lower surfaces of the power module are cooled
Data Source
AI summary
A power conversion device (100) includes: a plurality of power modules (201) which convert DC power into AC power; a DC wiring (22) which transmits DC power to the plurality of power modules (201); a circuit board (30) on which the plurality of power modules (201) are arranged and the DC wiring (22) is mounted; and a molding resin (23) which covers and seals the plurality of power modules (201) and the circuit board (30), in which the molding resin (23) has seal surface portions (231, 232) around the plurality of power modules (201), and the seal surface portions (231, 232) are thinner than regions sealing the plurality of power modules (201).