Power Module Packaging with Corner Resin Flow Guidance
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Solution Overview
Problem
The packaging process of power modules is prone to resin stagnation and accumulation at corners, leading to gaps that reduce insulation withstand voltage and reliability, due to resin flow being blocked by cavity corners during transfer molding.
Innovation Solution
Incorporating flow guide portions at the corners of the packaging body to guide resin flow, preventing stagnation and accumulation, ensuring continuous resin flow and reducing gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transfer molding is used to package power modules, then high integration level and convenience of use are achieved, but resin stagnation and accumulation occur at corners leading to gaps that reduce insulation withstand voltage and reliability
Solution Approach 1:
The flow guide portions are designed and positioned in advance within the mold cavity to proactively direct resin flow toward corner regions before stagnation can occur. This preliminary structural arrangement ensures that resin is guided along predetermined paths to fill corner areas uniformly, preventing gap formation and maintaining consistent insulation properties throughout the packaged power module.
2Adaptability or versatility
If resin is used to package power chips and control chips, then high integration level is achieved, but gaps form at corners reducing structural reliability
Solution Approach 1:
The flow guide portions act as intermediary structures within the mold cavity that mediate between the resin flow and the corner regions. These flow guide features redirect and channel the resin to ensure complete and uniform filling of corner areas, eliminating gaps while maintaining the high integration level achieved through resin packaging of multiple chips.
3Ease of manufacture
If corner regions are not properly filled with resin, then manufacturing is simpler, but insulation withstand voltage and electrical safety are reduced
Solution Approach 1:
The flow guide portions are pre-designed into the mold structure to automatically direct resin flow to corner regions during the normal packaging process. This preliminary structural arrangement ensures complete corner filling without requiring additional manufacturing steps or complex process adjustments, maintaining ease of manufacture while ensuring electrical safety through gap-free resin encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances insulation and electrical safety by maintaining resin continuity, eliminating gaps, and improving structural reliability without additional manufacturing devices or increased costs.
Implementation Method 1
The flow guide portion is configured to guide a resin to flow, so as to avoid a gap at the corner in the packaging body
Data Source
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AI summary
A power module, comprising a package, a power chip and a control chip that are located in the package, and a power pin and a control pin respectively led from first and second side surfaces of the package that are opposite to each other. The power chip is electrically connected to the control chip, the power pin is electrically connected to the power chip, and the control pin is electrically connected to the control chip. The package comprises a flow guide portion located at at least one corner thereof and configured to implement a resin flow guide function, so as to prevent the package from generating a gap at the corner.