Power Semiconductor Module Assembly for Sealed Liquid Cooling
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Solution Overview
Problem
Current power semiconductor modules face challenges in achieving effective sealing and heat dissipation due to gaps between the power device and heat sink, leading to reduced heat dissipation efficiency and reliability, especially in water cooling conditions.
Innovation Solution
A method involving plastic packaging of the power semiconductor module followed by soldering with a heat transfer material to securely connect the power semiconductor component to the heat sink, ensuring better integrity and waterproof performance, and allowing for advanced detection of sealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power device is first connected to the heat sink and then packaged, then the heat dissipation path is established, but the sealing performance cannot be ensured and gaps may appear between the power device and heat sink
Solution Approach 1:
The power device is packaged in plastic before being connected to the heat sink. This preliminary packaging action establishes a sealed structure that protects the power device and enables subsequent reliable connection to the heat sink with proper sealing, eliminating the positioning and sealing issues that occur when connection is done before packaging.
2Adaptability or versatility
If a heat dissipation medium is filled between the power device and heat sink for detachable connection, then the power device can be detached, but the relative position is not fixed and heat conduction efficiency is low
Solution Approach 1:
The power device is integrated with the heat sink through a unified packaging structure where the plastic package encapsulates the power device and forms a fixed connection interface with the heat sink. This merging eliminates gaps and ensures intimate thermal contact, achieving both secure attachment and high heat conduction efficiency.
3Reliability
If the power device is packaged in plastic first, then the relative position with heat sink is not fixed, but sealing performance is improved
Solution Approach 1:
The packaging structure integrates the power device and heat sink into a unified assembly where the plastic package forms a fixed mechanical connection with the heat sink. This integration simultaneously achieves waterproof sealing and stable relative positioning, eliminating the instability issue while maintaining sealing benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the sealing and heat dissipation performance of the power semiconductor module, ensuring stable operation in water cooling conditions and improving reliability by eliminating gaps and enhancing heat transfer efficiency.
Implementation Method 1
the first heat sink is configured to take away heat from the power semiconductor component
Implementation Method 2
When the first heat sink of the power semiconductor module takes away heat through liquid cooling
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
A method for producing a power semiconductor module is disclosed, including: packaging a power device in plastic to form a power semiconductor component, and forming a first heat dissipation face on a surface of the power semiconductor component; heating a first material between a first heat sink and the first heat dissipation face; and cooling the first material on the first heat dissipation face to connect the power semiconductor component and the first heat sink. According to the method for producing a power semiconductor module, the power semiconductor module is produced through plastic packaging and then soldering, so that the power semiconductor module has better integrity and higher waterproof performance. When the first heat sink of the power semiconductor module takes away heat through liquid cooling, a coolant does not easily penetrate into the power semiconductor component of the power semiconductor module, and sealing performance may be detected in advance, to improve reliability. This application further provides a power semiconductor module.