Power Module Packaging Structure for Moisture and Waterproof Sealing
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Solution Overview
Problem
Conventional power modules with silicone gel packaging exhibit poor moisture-proof and waterproof performance, limiting their reliability in harsh environments such as servo motors, frequency converters, and inverters.
Innovation Solution
A power module design featuring a substrate with a circuit layer, a sealing layer, and a plastic packaging layer made of thermosetting material, including boss structures and limiting structures to enhance waterproof and moisture-proof performance, along with a cover plate for additional protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silicone gel packaging is used, then the power module can be easily manufactured, but the moisture-proof and waterproof performance deteriorates
Solution Approach 1:
The patent changes the packaging material from silicone gel to plastic material, fundamentally altering the material parameter to achieve both good moisture-proof/waterproof performance and ease of manufacture through injection molding technology
Solution Approach 2:
The patent employs a composite packaging structure combining plastic material with specific structural features (boss structures, limiting structures) to achieve superior sealing performance while maintaining manufacturing ease
2Device complexity
If adhesive is used to bond the sealing layer, then the assembly process is simplified, but adhesive overflow occurs reducing sealing effectiveness
Solution Approach 1:
The patent extracts and eliminates the adhesive bonding step from the assembly process. The sealing layer is positioned and fixed through mechanical structures (boss structures and limiting structures) rather than chemical adhesion, completely removing the source of adhesive overflow
Solution Approach 2:
The boss structures and limiting structures serve as intermediary mechanical elements that mediate the positioning and fixation between the sealing layer and other components, replacing the adhesive intermediary and providing precise mechanical positioning
Data Source
Figure 1~3
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Figure 7~9b
AI summary
A power module, a preparation mold, and a device are provided. The power module includes a substrate (10), and the substrate (10) is used as a bearing structure to carry components (30) and pins (50) of the power module. A circuit layer is disposed on the substrate (10), to complete an electrical connection between the carried components (30). The components (30) and the pins (50) are disposed on a same surface of the substrate (10), and the components (30) and the pins (50) are electrically connected by using the substrate (10). The power module further includes a sealing layer (60). The sealing layer (60) is sleeved on the pins (50), the pins (50) are partially exposed on a surface that is of the sealing layer (60) and that faces away from the substrate (10), and a space for accommodating a plastic packaging layer (80) is formed between the sealing layer (60) and the substrate (10). To protect the components, the power module further includes the plastic packaging layer (80), and the plastic packaging layer (80) is filled between the sealing layer (60) and the substrate (10). The plastic packaging layer (80) is a plastic packaging layer (80) prepared by a thermosetting material. The thermosetting material may be packaged in an injection molding manner. In addition, the thermosetting material has good waterproof and moisture-proof performance, which improves waterproof and moisture-proof effects of the power module, and improves a protection effect of the power module.