Power Module With Sandwiched Base Plates and Segmented Fins
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Solution Overview
Problem
Conventional power converter devices face challenges in improving cooling performance while maintaining productivity, leading to increased complexity and costs due to the need for expanded heat dissipation areas in power semiconductors.
Innovation Solution
The implementation of a power converter device design featuring two base plates with a semiconductor circuit unit sandwiched between them, an insulating member for electrical insulation, and a connecting member with reduced rigidity, allowing for enhanced heat dissipation and assembly ease, along with a cylindrical case and insulating member for improved adhesion and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fins are formed on the base plate to expand heat dissipation area, then cooling performance is improved, but device complexity increases and productivity decreases
Solution Approach 1:
The invention transitions from two-dimensional heat dissipation (single base plate surface) to three-dimensional heat dissipation by forming fins that extend vertically from the base plate. This dimensional change dramatically increases the heat dissipation surface area without expanding the horizontal footprint of the power module, thereby improving cooling performance without increasing device complexity.
Solution Approach 2:
The base plate is segmented into multiple fin structures that divide and distribute heat across numerous smaller surfaces. This segmentation allows heat to be dissipated through multiple parallel pathways simultaneously, enhancing overall heat dissipation efficiency while maintaining a compact structure that does not increase device complexity.
2Temperature
If fins are formed on the base plate to expand heat dissipation area, then cooling performance is improved, but productivity decreases due to complicated structure
Solution Approach 1:
The fin structures are merged with the base plate to form an integrated heat dissipation component. This merging eliminates the need for separate assembly steps for attaching fins to the base plate, simplifying the manufacturing process and maintaining high productivity despite the enhanced three-dimensional heat dissipation structure.
3Reliability
If insulation distance between base plate and semiconductor circuit unit is increased, then electrical insulation is improved, but heat dissipation efficiency decreases
Solution Approach 1:
The insulating member is designed with non-uniform thickness, creating different insulation distances at different locations. Areas with lower electrical stress have reduced insulation thickness to maintain heat dissipation pathways, while areas with higher electrical stress maintain adequate insulation distance. This local differentiation allows the system to achieve both sufficient electrical insulation and effective heat dissipation.
Solution Approach 2:
The insulating member acts as an intermediary between the base plate and semiconductor circuit unit, providing electrical insulation while its optimized thickness and material properties allow thermal energy to pass through effectively. The intermediary is designed to selectively transmit electricity (blocking it) while permitting heat transfer, resolving the contradiction between insulation and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling performance, increases heat dissipation area, and simplifies the power module structure, thereby improving productivity and reducing costs by facilitating easier assembly and effective heat transfer.
Implementation Method 1
Heat generated by the power semiconductors is released to the base plate through a main surface on one side of the power semiconductors
Implementation Method 2
a cooling medium contacts directly with the fins
Data Source
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AI summary
A power module 300 and a power converter device 300 including the power module 300 include: two base plates with their main surfaces facing each other; a semiconductor circuit unit 300A disposed between the two base plates; a connecting member 304A that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit 300A is housed; and an insulating member 334A that is placed between the base plate and the semiconductor circuit unit 300A and secures electrical insulation of the base plate and the semiconductor circuit unit 300A. A rigidity or thickness of the connecting member 304A is less than a rigidity or thickness of the base plate.